EP4SE820H35C4G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,079 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H35C4G – Field Programmable Gate Array (FPGA) IC

The EP4SE820H35C4G is a high-density Field Programmable Gate Array from Intel, implemented on the Stratix IV device architecture. It delivers substantial on-chip resources—over 813,000 logic elements and approximately 34 Mbits of embedded memory—targeted at designs that require large logic capacity, extensive I/O, and advanced on-chip memory.

This device is suited for commercial-grade applications that leverage Stratix IV architecture features such as embedded memory, DSP resources, PLLs and clock networks, and support for high-speed interfaces. It is supplied in a high-pin-count FCBGA package and operates across a 0 °C to 85 °C temperature range with a low-voltage core supply of 0.87 V to 0.93 V.

Key Features

  • Core Capacity  813,050 logic elements for high-density logic implementation and complex system integration.
  • Embedded Memory  Approximately 34 Mbits of on-chip RAM to support large buffering, filtering, and storage requirements.
  • I/O Count & Connectivity  744 I/O pins to accommodate wide external interfacing and parallel connections.
  • Stratix IV Architecture  Built on the Stratix IV device family with architecture elements including DSP blocks, PLLs, clock networks, and high-speed transceiver support as described in the device handbook.
  • Package  1152-ball FCBGA / 1152-HBGA supplier package (42.5 × 42.5 mm) for compact, high-density board integration.
  • Power  Core supply range 0.870 V to 0.930 V enabling operation within defined low-voltage parameters.
  • Commercial Grade & Temperature  Rated for commercial operation from 0 °C to 85 °C.
  • RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

  • High‑performance communications  Use the device’s high logic density and Stratix IV transceiver and interface support to implement packet processing, switching, or protocol bridging functions.
  • Signal processing and DSP  Large embedded memory and architecture DSP resources support filtering, transforms, and real-time data manipulation.
  • Video and imaging systems  Leverage the device’s logic capacity and abundant I/O for frame buffering, parallel video pipelines, and format conversion.
  • Prototyping and complex system integration  High I/O count and a compact FCBGA package make the part suitable for prototype platforms and multi‑function SoC prototyping.

Unique Advantages

  • High logic density: 813,050 logic elements allow consolidation of large functions into a single FPGA, reducing system complexity and BOM count.
  • Substantial on-chip memory: Approximately 34 Mbits of embedded RAM supports deep buffering and large data structures without immediate dependence on external memory.
  • Extensive I/O resources: 744 I/O pins provide design flexibility for wide parallel interfaces, multiple peripherals, and complex board routing.
  • Proven Stratix IV architecture: Architecture features listed in the Stratix IV device handbook—clock networks, PLLs, DSP blocks, and high-speed transceivers—enable scalable, timing‑sensitive designs.
  • Compact high‑pin package: 1152-ball FCBGA (42.5 × 42.5 mm) balances high pin count with a board-friendly footprint for dense system layouts.
  • Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant, supporting common commercial deployment scenarios.

Why Choose EP4SE820H35C4G?

The EP4SE820H35C4G positions itself as a high-capacity FPGA choice for commercial applications that require a combination of large logic resources, considerable embedded memory, and extensive I/O. Its Stratix IV-based architecture provides the building blocks—DSP resources, clocking, and transceiver support—needed for bandwidth- and compute-intensive designs.

This device is ideal for engineering teams developing communications, signal-processing, video, or large-scale prototyping systems where on-chip integration reduces external components and simplifies board-level design. The combination of package density, power rail specification, commercial temperature rating, and RoHS compliance delivers a practical, verifiable solution for production systems.

If you would like pricing, availability, or a formal quote for EP4SE820H35C4G, submit a request or contact a sales channel to request a quote and begin procurement.

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