EP4SE820H35C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,079 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H35C4G – Field Programmable Gate Array (FPGA) IC
The EP4SE820H35C4G is a high-density Field Programmable Gate Array from Intel, implemented on the Stratix IV device architecture. It delivers substantial on-chip resources—over 813,000 logic elements and approximately 34 Mbits of embedded memory—targeted at designs that require large logic capacity, extensive I/O, and advanced on-chip memory.
This device is suited for commercial-grade applications that leverage Stratix IV architecture features such as embedded memory, DSP resources, PLLs and clock networks, and support for high-speed interfaces. It is supplied in a high-pin-count FCBGA package and operates across a 0 °C to 85 °C temperature range with a low-voltage core supply of 0.87 V to 0.93 V.
Key Features
- Core Capacity 813,050 logic elements for high-density logic implementation and complex system integration.
- Embedded Memory Approximately 34 Mbits of on-chip RAM to support large buffering, filtering, and storage requirements.
- I/O Count & Connectivity 744 I/O pins to accommodate wide external interfacing and parallel connections.
- Stratix IV Architecture Built on the Stratix IV device family with architecture elements including DSP blocks, PLLs, clock networks, and high-speed transceiver support as described in the device handbook.
- Package 1152-ball FCBGA / 1152-HBGA supplier package (42.5 × 42.5 mm) for compact, high-density board integration.
- Power Core supply range 0.870 V to 0.930 V enabling operation within defined low-voltage parameters.
- Commercial Grade & Temperature Rated for commercial operation from 0 °C to 85 °C.
- RoHS Compliant Conforms to RoHS environmental requirements.
Typical Applications
- High‑performance communications Use the device’s high logic density and Stratix IV transceiver and interface support to implement packet processing, switching, or protocol bridging functions.
- Signal processing and DSP Large embedded memory and architecture DSP resources support filtering, transforms, and real-time data manipulation.
- Video and imaging systems Leverage the device’s logic capacity and abundant I/O for frame buffering, parallel video pipelines, and format conversion.
- Prototyping and complex system integration High I/O count and a compact FCBGA package make the part suitable for prototype platforms and multi‑function SoC prototyping.
Unique Advantages
- High logic density: 813,050 logic elements allow consolidation of large functions into a single FPGA, reducing system complexity and BOM count.
- Substantial on-chip memory: Approximately 34 Mbits of embedded RAM supports deep buffering and large data structures without immediate dependence on external memory.
- Extensive I/O resources: 744 I/O pins provide design flexibility for wide parallel interfaces, multiple peripherals, and complex board routing.
- Proven Stratix IV architecture: Architecture features listed in the Stratix IV device handbook—clock networks, PLLs, DSP blocks, and high-speed transceivers—enable scalable, timing‑sensitive designs.
- Compact high‑pin package: 1152-ball FCBGA (42.5 × 42.5 mm) balances high pin count with a board-friendly footprint for dense system layouts.
- Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant, supporting common commercial deployment scenarios.
Why Choose EP4SE820H35C4G?
The EP4SE820H35C4G positions itself as a high-capacity FPGA choice for commercial applications that require a combination of large logic resources, considerable embedded memory, and extensive I/O. Its Stratix IV-based architecture provides the building blocks—DSP resources, clocking, and transceiver support—needed for bandwidth- and compute-intensive designs.
This device is ideal for engineering teams developing communications, signal-processing, video, or large-scale prototyping systems where on-chip integration reduces external components and simplifies board-level design. The combination of package density, power rail specification, commercial temperature rating, and RoHS compliance delivers a practical, verifiable solution for production systems.
If you would like pricing, availability, or a formal quote for EP4SE820H35C4G, submit a request or contact a sales channel to request a quote and begin procurement.

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