EP4SE820H35C4N

IC FPGA 744 I/O 1152HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 34093056 813050 1152-BBGA, FCBGA

Quantity 330 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H35C4N – STRATIX® IV E FPGA, 1152-BBGA

The EP4SE820H35C4N is a Field Programmable Gate Array (FPGA) IC from the STRATIX® IV E family, offered in a 1152-BBGA (FCBGA) package. It combines a high logic capacity with substantial on-chip memory and a large I/O count to address complex digital designs that require significant integration on a single device.

As documented in the Stratix IV device handbook, the STRATIX IV E family provides architecture elements such as embedded memory, DSP blocks, high-speed transceiver features, external memory interfaces, and advanced clocking resources that support demanding communication, signal processing, and system-integration tasks.

Key Features

  • High Logic Capacity — Approximately 813,050 logic elements suitable for large-scale integration and complex FPGA implementations.
  • Significant Embedded Memory — Approximately 34 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
  • Extensive I/O — 744 I/O pins provide flexible connectivity for parallel interfaces, memory buses, and peripheral integration.
  • FPGA Family Capabilities — Stratix IV E architecture includes embedded memory blocks, DSP blocks, high-speed transceiver features, external memory interfaces, PLLs, and advanced clock networks as described in the device handbook.
  • Package and Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA with a 42.5 × 42.5 mm footprint; surface-mount mounting type for standard PCB assembly.
  • Supply and Temperature — Core supply range specified from 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • High‑Throughput Networking — Large logic capacity and the STRATIX IV E family’s high-speed transceiver and bandwidth features support packet processing and protocol handling.
  • Signal Processing and DSP — Substantial on-chip memory and DSP block availability make the device suitable for filtering, FFTs, and real-time signal chains.
  • Memory Interface and Controllers — Extensive I/O and dedicated external memory interface support from the family enable implementation of memory controllers and data buffering systems.
  • System Integration — High I/O count and dense logic allow integration of multiple subsystems and custom SoC-style functions on a single FPGA package.

Unique Advantages

  • Large-Scale Integration: ~813,050 logic elements enable consolidation of complex functions that would otherwise require multiple devices.
  • Substantial On-Chip Memory: Approximately 34 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage tasks.
  • High I/O Density: 744 I/O pins provide the flexibility to connect wide memory buses, high-pin-count peripherals, and parallel interfaces without external multiplexing.
  • Family-Level High-Speed Capabilities: The Stratix IV E device family includes high-speed transceiver and external memory interface features, supporting high aggregate data bandwidth designs.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet standard commercial-environment requirements.
  • Standards-Friendly Packaging: 1152-BBGA (FCBGA) / 1152-HBGA (42.5 × 42.5 mm) package for established board-level assembly flows.

Why Choose EP4SE820H35C4N?

The EP4SE820H35C4N positions itself for designs that require a combination of very high logic density, considerable embedded memory, and a large number of I/Os within a single FPGA package. Its placement in the STRATIX IV E family means designers can leverage device-family features such as DSP blocks, advanced clocking, and high-speed transceiver capabilities documented in the Stratix IV device handbook.

This commercial-grade device is suitable for customers building high-performance communication, signal-processing, and system-integration products who need a scalable, high-capacity FPGA platform backed by the Stratix IV device documentation and family resources.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4SE820H35C4N. Our team can provide lead-time estimates and support for procurement and deployment planning.

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