EP4SE820H35I4

The EP4SE820H35I4 is a STRATIX® IV E field programmable gate array from Intel designed for high-density, industrial-grade programmable logic applications. It provides a large logic fabric and on-chip memory capacity in a compact FCBGA package for system designs that require substantial integration of programmable logic and embedded memory.

Key attributes include 813,050 logic elements, approximately 34.1 Mbits of embedded memory, support for up to 744 I/O pins, and operation across an industrial temperature range with low-voltage core supply requirements. These characteristics make the device suitable for demanding industrial and embedded systems where logic capacity, I/O density, and reliability matter.

Key Features

• Core Logic  Provides 813,050 logic elements to implement large, complex digital designs and custom logic functions.
• Embedded Memory  Approximately 34.1 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic blocks.
• I/O Density  Up to 744 I/O pins to support broad interfacing and multiple parallel connections in system designs.
• Power  Core voltage supply range of 870 mV to 930 mV to match low-voltage system power domains.
• Package & Mounting  1152-BBGA FCBGA package (supplier package listed as 1152-HBGA, 42.5 × 42.5 mm) optimized for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial control systems  Use the device's industrial temperature rating and high logic capacity for custom control, sequencing, and interfacing tasks in factory and process automation.
• High-density logic integration  Implement complex custom logic and large finite-state machines where the large count of logic elements and embedded memory reduce external component count.
• Custom I/O and protocol bridging  Leverage 744 I/O pins to aggregate, translate, or route multiple interfaces and signals within compact systems.

Unique Advantages

• High logic capacity: 813,050 logic elements enable consolidation of large digital functions into a single device, simplifying board-level design.
• Substantial embedded memory: Approximately 34.1 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state storage needs.
• Broad I/O count: 744 I/O pins support complex interfacing and parallel connectivity without additional interface devices.
• Industrial-rated operation: −40 °C to 100 °C temperature range supports deployment in harsh or temperature-variable environments.
• Compact FCBGA package: The 1152-ball BBGA/1152-HBGA (42.5 × 42.5 mm) form factor balances area efficiency with high pin count for dense system-level integration.
• Low-voltage core compatibility: 870 mV–930 mV supply range aligns with modern low-voltage power architectures to help optimize board power design.

Why Choose EP4SE820H35I4?

The EP4SE820H35I4 combines a large programmable fabric, significant embedded memory, and extensive I/O in an industrial-grade FPGA package from Intel. It is positioned for designs that require high logic density, substantial on-chip RAM, and reliable operation across a wide temperature range.

This device is suited to engineers and system architects building industrial and embedded systems that benefit from consolidating complex logic and interfacing into a single programmable device, offering scalability for evolving design requirements and the manufacturing advantages of a compact surface-mount FCBGA package.

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