EP4SE820H40C3

The EP4SE820H40C3 is a Stratix IV E family FPGA from Intel, providing a high-density programmable core with 813,050 logic elements and approximately 34 Mbits of embedded memory. With 976 user I/Os, this surface-mount FCBGA device is tailored for designs that require large logic capacity and extensive I/O connectivity.

Specified for commercial-grade operation (0 °C to 85 °C) and RoHS compliant, the device is offered in a 1517-BBGA/1517-HBGA package (42.5 × 42.5 mm) and operates from a core supply range of 870 mV to 930 mV, enabling precise power provisioning for complex FPGA designs.

Key Features

• Core Capacity  813,050 logic elements provide extensive programmable fabric for large-scale FPGA implementations.
• Embedded Memory  Approximately 34 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions directly in the fabric.
• I/O Density  976 user I/Os to connect multiple peripherals, high-pin-count interfaces, and parallel buses without external multiplexing.
• Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm) designed for surface-mount assembly on high-density PCBs.
• Power  Core supply range from 870 mV to 930 mV allows targeted power design and regulation for the device core.
• Operating Conditions  Commercial operating temperature range from 0 °C to 85 °C; device grade: Commercial.
• Compliance  RoHS compliant, suitable for designs requiring lead-free, environmentally compliant components.

Typical Applications

• High-density logic systems  Large programmable fabric and abundant I/O make the device suitable for complex control and compute tasks within high-density logic systems.
• Data buffering and packet processing  Significant on-chip RAM supports buffering and intermediate storage for data-paths and packet-processing functions.
• Multi-interface aggregation  High I/O count enables aggregation of diverse parallel interfaces and peripheral connectivity on a single FPGA.
• Signal processing  Large logic capacity and embedded memory facilitate implementation of signal processing chains and custom datapaths.

Unique Advantages

• Scalable logic capacity:  813,050 logic elements let designers implement large, integrated designs without partitioning across multiple devices.
• On-chip memory availability:  Approximately 34 Mbits of embedded RAM reduce reliance on external memory for mid-sized buffering and state storage.
• High I/O count:  976 user I/Os simplify system integration by supporting many external signals and interfaces directly.
• Compact, manufacturable package:  1517-BBGA/1517-HBGA FCBGA packaging provides a high-pin-count solution in a defined footprint for surface-mount assembly.
• Commercial-grade reliability:  Specified 0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial electronics requirements.

Why Choose EP4SE820H40C3?

The EP4SE820H40C3 positions itself as a high-density Stratix IV E FPGA option for designs that require substantial logic resources, significant embedded memory, and a large number of I/Os in a single, surface-mount FCBGA package. Its commercial-grade temperature range, RoHS compliance, and defined core voltage window support repeatable integration into production systems.

This device is appropriate for engineering teams building complex digital systems where on-chip capacity, I/O connectivity, and a compact package footprint are primary selection criteria. The combination of programmable resources and package density supports scalable designs while maintaining clear electrical and mechanical specifications for implementation.

Request a quote or submit an inquiry to get pricing and availability for the EP4SE820H40C3 and to discuss how it fits your next high-density FPGA design.