EP4SE820H40C4

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

Quantity 1,025 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H40C4 – STRATIX® IV E Field Programmable Gate Array (FPGA)

The EP4SE820H40C4 is a STRATIX® IV E field programmable gate array (FPGA) from Intel, offered in a high-density FCBGA package. It provides a large logic fabric, substantial on-chip memory, and extensive I/O capability for commercial‑grade digital designs.

With 813,050 logic elements and approximately 34.09 Mbits of embedded memory, this device is suited for designs that require high logic capacity, significant local RAM, and broad external connectivity while operating within standard commercial temperature and supply ranges.

Key Features

  • Core Logic 813,050 logic elements providing high integration density for complex digital functions; includes 32,522 logic array blocks.
  • Embedded Memory Approximately 34.09 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many use cases.
  • I/O Density 976 I/Os to enable broad external interfacing and multiple parallel connections to peripherals, sensors, or other logic devices.
  • Power Supply Core voltage range of 870 mV to 930 mV, supporting low-voltage core operation in compatible system power architectures.
  • Package 1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm) for compact, high-pin-count board implementations.
  • Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial electronics deployments.
  • Environmental Compliance RoHS compliant, meeting common environmental and lead-free requirements for commercial products.

Typical Applications

  • High‑density digital processing — Use the large logic element count and embedded memory to implement complex data-paths, packet processing, or parallel computation tasks.
  • Interface aggregation and bridging — Leverage 976 I/Os to connect multiple peripheral buses or aggregate signals between subsystems.
  • Prototyping and system evaluation — The combination of high logic capacity and on‑chip RAM makes the device suitable for development platforms and advanced prototyping.
  • Commercial networking and communications — High logic and I/O density support protocol handling and custom interface logic in commercial networking equipment.

Unique Advantages

  • High logic capacity: 813,050 logic elements enable implementation of large-scale, complex digital systems without partitioning across multiple FPGAs.
  • Significant on-chip memory: Approximately 34.09 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying board design.
  • Extensive connectivity: 976 I/Os provide flexibility to interface with numerous peripherals, high-pin-count connectors, and parallel data channels.
  • Compact high‑pin package: 1517-BBGA (42.5 × 42.5 mm supplier package) delivers a high I/O count in a space-efficient footprint for dense board layouts.
  • Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant, fitting mainstream commercial product requirements.
  • Low-voltage core operation: 870 mV to 930 mV supply range supports integration into modern low-voltage power domains.

Why Choose EP4SE820H40C4?

The EP4SE820H40C4 positions itself as a high‑capacity, commercially graded FPGA option for engineers who need substantial logic resources, ample embedded RAM, and broad I/O in a compact FCBGA package. Its specifications make it suitable for commercial designs demanding integration of complex digital functions and extensive external interfacing while operating within standard commercial temperature and voltage ranges.

This Intel STRATIX® IV E device delivers a balance of scale and integration that supports long-term design scalability—allowing teams to consolidate functionality, reduce external components, and accelerate development cycles for commercial electronic products.

Request a quote or submit a purchase inquiry for EP4SE820H40C4 to get pricing and availability information for your project requirements.

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