EP4SE820H35I4N

IC FPGA 744 I/O 1152HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 744 34093056 813050 1152-BBGA, FCBGA

Quantity 528 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H35I4N – STRATIX® IV E FPGA, 813,050 logic elements, 744 I/O, 1152-BBGA

The EP4SE820H35I4N is an Intel STRATIX® IV E field-programmable gate array (FPGA) supplied in a 1152-ball BGA package. It delivers a large programmable fabric—813,050 logic elements—and rich on-chip memory resources, suitable for demanding industrial and high-performance system designs.

Designed for applications that require substantial logic capacity, dense I/O, and on-chip storage, this device couples the Stratix IV E device family architecture (including embedded memory, DSP resources, PLLs and advanced I/O features) with an industrial operating range and a compact FCBGA footprint.

Key Features

  • Programmable Fabric: 813,050 logic elements for implementation of large custom logic, control and datapath functions.
  • Embedded Memory: Approximately 34 Mbits of on-chip RAM to support buffering, packet processing, or large lookup-table storage.
  • High I/O Density: 744 I/O pins to enable extensive external interfacing and parallel connectivity in dense system designs.
  • Device Family Capabilities: Stratix IV E architecture features including DSP blocks, PLLs, clock networks, and high-speed transceiver/I/O features as documented in the device handbook.
  • Industrial Grade: Specified for industrial applications with an operating temperature range of −40 °C to 100 °C.
  • Power Supply Range: Core voltage specified from 870 mV to 930 mV to align with system power-rail planning.
  • Package and Mounting: Surface-mount 1152-BBGA (FCBGA) package; supplier package listed as 1152-HBGA with 42.5 × 42.5 mm body for PCB layout and thermal considerations.
  • RoHS Compliant: Conforms to RoHS requirements for regulated substance content.

Typical Applications

  • High-speed data processing: Large logic capacity and substantial embedded memory make the device suitable for packet processing, protocol handling, and complex datapath implementations.
  • Telecommunications infrastructure: Dense I/O and Stratix IV E family I/O/transceiver features support multi-channel interfaces and backbone signal handling.
  • Industrial control and automation: Industrial temperature rating and abundant logic enable advanced motor control, real-time control algorithms, and machine-vision pre-processing.
  • Signal processing and DSP: On-chip memory and the family’s DSP resources support filter engines, FFTs, and other compute-intensive algorithms.

Unique Advantages

  • Large programmable capacity: 813,050 logic elements provide headroom for complex, integrated system designs and architecture consolidation.
  • Integrated memory resources: Approximately 34 Mbits of embedded RAM reduce external memory dependency and simplify board-level BOM.
  • High interface count: 744 I/O pins allow flexible routing and direct connectivity to multiple subsystems or high-pin-count peripherals.
  • Industrial robustness: Specified −40 °C to 100 °C operation supports deployment in harsh or wide-temperature environments.
  • System-level building blocks: Family-level features (PLLs, clock networks, DSP blocks, and high-speed I/O) streamline implementation of timing, DSP and interface requirements.
  • RoHS compliance: Simplifies regulatory alignment for environmentally constrained markets.

Why Choose EP4SE820H35I4N?

The EP4SE820H35I4N positions itself as a high-capacity FPGA option within the STRATIX IV E family, combining a very large logic element count, significant on-chip RAM, and a high I/O count in a compact BGA package. Its industrial temperature rating and defined core-voltage window make it appropriate for engineered systems that require reliable operation across a broad temperature range.

This device is well suited to teams building complex signal-processing, communications, or control systems that benefit from integrating logic, memory and interface functionality into a single programmable device, while relying on Intel’s Stratix IV device architecture documented in the device handbook.

Request a quote or submit an inquiry to check availability, lead times and pricing for EP4SE820H35I4N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up