EP4SE820H40C4N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA |
|---|---|
| Quantity | 488 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H40C4N – STRATIX® IV E FPGA, 813,050 logic elements, 976 I/Os
The EP4SE820H40C4N is a Stratix IV E field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It delivers a high on-chip logic capacity and a large embedded memory footprint targeted at high-density, high-bandwidth digital designs.
Designed for applications requiring extensive I/O and on-chip resources, this commercial-grade FPGA provides a balance of integration and performance with core voltage operation between 870 mV and 930 mV and an operating temperature range of 0 °C to 85 °C.
Key Features
- High logic capacity — 813,050 logic elements for complex, large-scale digital implementations and dense logic integration.
- Significant embedded memory — Approximately 34 Mbits of on-chip RAM to support buffering, frame storage, and local data processing.
- Extensive I/O — 976 general-purpose I/Os to accommodate broad interfacing needs and multi-channel connectivity.
- Stratix IV E architecture — Part of the Stratix IV E device family, with architecture-level features documented in the device handbook including embedded memory, DSP resources, clock networks, PLLs, and I/O capabilities.
- Package and mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA with 42.5 × 42.5 mm footprint; surface-mount device for PCB integration.
- Power and thermal — Core voltage supply range of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS-compliant construction for environmental compliance in commercial applications.
Typical Applications
- High-density digital processing — Large logic capacity and substantial on-chip RAM make the device suitable for complex data-paths and custom processing pipelines.
- Multi-channel I/O systems — With 976 I/Os the FPGA can handle numerous parallel interfaces, sensor arrays, or multi-lane communication endpoints.
- High-bandwidth buffering and memory interfacing — Approximately 34 Mbits of embedded memory supports local buffering and intermediate storage for streaming or burst data flows.
Unique Advantages
- High integration density: 813,050 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Large on-chip memory: Approximately 34 Mbits of RAM reduces dependence on external memory for many buffering and caching tasks.
- Broad I/O capacity: 976 I/Os allow flexible signal partitioning and extensive peripheral connectivity without immediate need for external expanders.
- Compact, manufacturable package: 1517-ball FCBGA with surface-mount mounting supports automated assembly and a compact board footprint (supplier package dimension 42.5 × 42.5 mm).
- Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
- Stratix IV E family support: Documented architecture features (memory, DSP blocks, clock networks, PLLs, and I/O capabilities) provide a clear technical foundation for design planning.
Why Choose EP4SE820H40C4N?
The EP4SE820H40C4N positions itself as a high-capacity Stratix IV E FPGA suited for designs that require a large number of logic elements, substantial embedded memory, and wide I/O support. Its commercial temperature rating and RoHS compliance make it appropriate for demanding commercial and enterprise-class applications where integration density and on-chip resources are priorities.
Engineers selecting this part benefit from the Stratix IV E device family documentation and a known architecture that includes memory and DSP capabilities, making the device a practical choice for scalable, resource-intensive digital designs.
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