EP4SE820H40C4N

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

Quantity 488 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H40C4N – STRATIX® IV E FPGA, 813,050 logic elements, 976 I/Os

The EP4SE820H40C4N is a Stratix IV E field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It delivers a high on-chip logic capacity and a large embedded memory footprint targeted at high-density, high-bandwidth digital designs.

Designed for applications requiring extensive I/O and on-chip resources, this commercial-grade FPGA provides a balance of integration and performance with core voltage operation between 870 mV and 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • High logic capacity — 813,050 logic elements for complex, large-scale digital implementations and dense logic integration.
  • Significant embedded memory — Approximately 34 Mbits of on-chip RAM to support buffering, frame storage, and local data processing.
  • Extensive I/O — 976 general-purpose I/Os to accommodate broad interfacing needs and multi-channel connectivity.
  • Stratix IV E architecture — Part of the Stratix IV E device family, with architecture-level features documented in the device handbook including embedded memory, DSP resources, clock networks, PLLs, and I/O capabilities.
  • Package and mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA with 42.5 × 42.5 mm footprint; surface-mount device for PCB integration.
  • Power and thermal — Core voltage supply range of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS-compliant construction for environmental compliance in commercial applications.

Typical Applications

  • High-density digital processing — Large logic capacity and substantial on-chip RAM make the device suitable for complex data-paths and custom processing pipelines.
  • Multi-channel I/O systems — With 976 I/Os the FPGA can handle numerous parallel interfaces, sensor arrays, or multi-lane communication endpoints.
  • High-bandwidth buffering and memory interfacing — Approximately 34 Mbits of embedded memory supports local buffering and intermediate storage for streaming or burst data flows.

Unique Advantages

  • High integration density: 813,050 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Large on-chip memory: Approximately 34 Mbits of RAM reduces dependence on external memory for many buffering and caching tasks.
  • Broad I/O capacity: 976 I/Os allow flexible signal partitioning and extensive peripheral connectivity without immediate need for external expanders.
  • Compact, manufacturable package: 1517-ball FCBGA with surface-mount mounting supports automated assembly and a compact board footprint (supplier package dimension 42.5 × 42.5 mm).
  • Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
  • Stratix IV E family support: Documented architecture features (memory, DSP blocks, clock networks, PLLs, and I/O capabilities) provide a clear technical foundation for design planning.

Why Choose EP4SE820H40C4N?

The EP4SE820H40C4N positions itself as a high-capacity Stratix IV E FPGA suited for designs that require a large number of logic elements, substantial embedded memory, and wide I/O support. Its commercial temperature rating and RoHS compliance make it appropriate for demanding commercial and enterprise-class applications where integration density and on-chip resources are priorities.

Engineers selecting this part benefit from the Stratix IV E device family documentation and a known architecture that includes memory and DSP capabilities, making the device a practical choice for scalable, resource-intensive digital designs.

Request a quote or submit an inquiry to receive pricing, availability, and procurement options for EP4SE820H40C4N.

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