EP4SE820H35I3

The EP4SE820H35I3 is a Stratix IV E field-programmable gate array (FPGA) offered in an industrial-grade package. It delivers high logic density, sizable on-chip memory, and a large I/O complement for complex system integration.

Built on the Stratix IV E device family architecture, this device targets applications that require extensive programmable logic, embedded memory, and robust I/O capacity while operating across industrial temperature ranges.

Key Features

• Core Logic — Approximately 813,050 logic elements provide substantial programmable fabric for complex digital designs.
• Embedded Memory — Approximately 34.09 Mbits of on-chip RAM to support buffering, packet memory and data-path requirements.
• I/O Capability — 744 device I/O pins to enable broad external connectivity and multi-interface designs.
• Power — Core voltage supply range of 870 mV to 930 mV for the FPGA core.
• Package & Mounting — Surface-mount 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA (42.5×42.5 mm).
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Architecture Highlights (Stratix IV E) — Device handbook references embedded memory, DSP blocks, PLLs, clock networks and high-speed transceiver features as part of the Stratix IV family architecture.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Networking & Communications — Use the device’s high logic density and extensive I/O to implement protocol processing, packet switching and interface bridging.
• Digital Signal Processing — Leverage the device’s large logic and embedded memory resources for DSP pipelines, filtering and real-time data manipulation.
• External Memory Interfaces — Combine on-chip memory with external memory controllers to support buffering and high-throughput data paths.
• Industrial Control & Automation — Industrial temperature rating and robust I/O count make the device suitable for control systems, motion control and sensor aggregation.

Unique Advantages

• High logic capacity: Approximately 813,050 logic elements consolidate complex logic into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 34.09 Mbits of on-chip RAM supports large buffers and on-chip data storage for deterministic processing.
• Extensive I/O density: 744 I/O pins enable multiple simultaneous interfaces and flexible system partitioning.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh environments.
• Compact, surface-mount package: 1152-BBGA/1152-HBGA package options provide a high-pin-count solution in a defined footprint (42.5×42.5 mm supplier package).
• Low-voltage core operation: 870–930 mV core supply aligns with modern FPGA power domains for optimized system power design.

Why Choose EP4SE820H35I3?

The EP4SE820H35I3 positions itself as a high-density Stratix IV E FPGA suitable for designs that require a large programmable fabric, substantial on-chip RAM, and a broad I/O complement within an industrial operating range. Its combination of logic capacity, embedded memory and package options enables integration of complex functions while reducing external component needs.

This device is appropriate for engineering teams developing advanced communications, signal-processing or industrial control systems that require scalable, reliable programmable logic and the ecosystem documented in the Stratix IV device handbook.

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