EP4SGX110DF29C2XG

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 9793536 105600 780-BBGA, FCBGA

Quantity 113 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110DF29C2XG – Stratix® IV GX FPGA, 105,600 logic elements, 372 I/Os

The EP4SGX110DF29C2XG is a Stratix® IV GX field programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package. It combines a large programmable fabric with substantial embedded memory and a high I/O count, targeting designs that require significant logic capacity, on-chip RAM, and advanced I/O capability.

Built for commercial-grade applications, the device supports features described for the Stratix IV family—including embedded memory, DSP resources, clocking and PLL structures, and high-speed transceiver capabilities—making it suitable for systems that need protocol support, high aggregate data bandwidth, and flexible system integration.

Key Features

  • Logic Capacity  105,600 logic elements provide extensive programmable fabric for complex custom logic and control functions.
  • Embedded Memory  Approximately 9.79 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Density  372 I/O pins to support broad interfacing needs across parallel buses, control signals, and external peripherals.
  • Stratix IV Family Architecture  Includes family-level features such as DSP blocks, clock networks and PLLs, and diagnostic and signal-integrity capabilities as described in the Stratix IV device handbook.
  • High-Speed Transceiver Support  Device documentation references high-speed transceiver features and support for a wide range of protocols and external memory interfaces.
  • Power and Supply  Specified core voltage range of 870 mV to 930 mV for the programmable core supply.
  • Package and Mounting  780-ball FCBGA package (29×29) in a surface-mount form factor for dense board integration.
  • Commercial Grade  Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Typical Applications

  • High‑Speed Networking and Telecom  Implements protocol logic and high aggregate data paths where transceiver and I/O density help manage serial links and interface logic.
  • Digital Signal Processing  Uses the device’s logic capacity and embedded memory for DSP pipelines, streaming data processing, and real‑time filtering tasks.
  • Memory Interface and Control  Acts as a flexible controller for external memory interfaces and buffering thanks to on‑chip RAM and abundant I/Os.
  • System Integration and Prototyping  Provides programmable fabric and clocking resources to integrate multiple system functions or to prototype complex ASIC functions.

Unique Advantages

  • Large Programmable Fabric: 105,600 logic elements enable implementation of complex logic, state machines, and mixed-function systems on a single device.
  • Substantial On‑Chip RAM: Approximately 9.79 Mbits of embedded memory reduces the need for external buffering and supports low-latency data paths.
  • High I/O Count: 372 I/Os provide flexible system interfacing and support for parallel and serial connectivity options.
  • Family-Level Transceiver and Interface Support: Stratix IV documentation highlights high-speed transceiver features and protocol support, aiding designs that require significant bandwidth and protocol flexibility.
  • Compact, Surface-Mount Package: 780-FBGA (29×29) offers a high pin-count, compact footprint for dense PCB layouts.
  • Commercial Temperature and Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose EP4SGX110DF29C2XG?

The EP4SGX110DF29C2XG combines a large logic element count, nearly 9.79 Mbits of embedded RAM, and a high I/O complement in a compact FCBGA package—features that position it for demanding commercial applications requiring significant programmable resources and flexible interfacing. Documentation for the Stratix IV family also details on‑chip DSP resources, clocking/PLL infrastructure, and high-speed transceiver and protocol support, offering an integrated platform for systems with high aggregate data bandwidth needs.

This part is suited to engineering teams building complex FPGA-based subsystems, high-throughput data paths, or memory-interface controllers that benefit from dense logic, local memory, and the Stratix IV family feature set. Its commercial rating and RoHS compliance support standard production environments and regulatory needs for a wide range of products.

Request a quote or submit an inquiry for pricing and availability of EP4SGX110DF29C2XG to begin the next stage of your design evaluation.

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