EP4SGX110DF29C2XG
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 9793536 105600 780-BBGA, FCBGA |
|---|---|
| Quantity | 113 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110DF29C2XG – Stratix® IV GX FPGA, 105,600 logic elements, 372 I/Os
The EP4SGX110DF29C2XG is a Stratix® IV GX field programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package. It combines a large programmable fabric with substantial embedded memory and a high I/O count, targeting designs that require significant logic capacity, on-chip RAM, and advanced I/O capability.
Built for commercial-grade applications, the device supports features described for the Stratix IV family—including embedded memory, DSP resources, clocking and PLL structures, and high-speed transceiver capabilities—making it suitable for systems that need protocol support, high aggregate data bandwidth, and flexible system integration.
Key Features
- Logic Capacity 105,600 logic elements provide extensive programmable fabric for complex custom logic and control functions.
- Embedded Memory Approximately 9.79 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Density 372 I/O pins to support broad interfacing needs across parallel buses, control signals, and external peripherals.
- Stratix IV Family Architecture Includes family-level features such as DSP blocks, clock networks and PLLs, and diagnostic and signal-integrity capabilities as described in the Stratix IV device handbook.
- High-Speed Transceiver Support Device documentation references high-speed transceiver features and support for a wide range of protocols and external memory interfaces.
- Power and Supply Specified core voltage range of 870 mV to 930 mV for the programmable core supply.
- Package and Mounting 780-ball FCBGA package (29×29) in a surface-mount form factor for dense board integration.
- Commercial Grade Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.
Typical Applications
- High‑Speed Networking and Telecom Implements protocol logic and high aggregate data paths where transceiver and I/O density help manage serial links and interface logic.
- Digital Signal Processing Uses the device’s logic capacity and embedded memory for DSP pipelines, streaming data processing, and real‑time filtering tasks.
- Memory Interface and Control Acts as a flexible controller for external memory interfaces and buffering thanks to on‑chip RAM and abundant I/Os.
- System Integration and Prototyping Provides programmable fabric and clocking resources to integrate multiple system functions or to prototype complex ASIC functions.
Unique Advantages
- Large Programmable Fabric: 105,600 logic elements enable implementation of complex logic, state machines, and mixed-function systems on a single device.
- Substantial On‑Chip RAM: Approximately 9.79 Mbits of embedded memory reduces the need for external buffering and supports low-latency data paths.
- High I/O Count: 372 I/Os provide flexible system interfacing and support for parallel and serial connectivity options.
- Family-Level Transceiver and Interface Support: Stratix IV documentation highlights high-speed transceiver features and protocol support, aiding designs that require significant bandwidth and protocol flexibility.
- Compact, Surface-Mount Package: 780-FBGA (29×29) offers a high pin-count, compact footprint for dense PCB layouts.
- Commercial Temperature and Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
Why Choose EP4SGX110DF29C2XG?
The EP4SGX110DF29C2XG combines a large logic element count, nearly 9.79 Mbits of embedded RAM, and a high I/O complement in a compact FCBGA package—features that position it for demanding commercial applications requiring significant programmable resources and flexible interfacing. Documentation for the Stratix IV family also details on‑chip DSP resources, clocking/PLL infrastructure, and high-speed transceiver and protocol support, offering an integrated platform for systems with high aggregate data bandwidth needs.
This part is suited to engineering teams building complex FPGA-based subsystems, high-throughput data paths, or memory-interface controllers that benefit from dense logic, local memory, and the Stratix IV family feature set. Its commercial rating and RoHS compliance support standard production environments and regulatory needs for a wide range of products.
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