EP4SGX110DF29C4

The EP4SGX110DF29C4 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel designed for applications that require substantial programmable logic, on-chip memory, and high I/O density. This device integrates 105,600 logic elements with approximately 9.79 Mbits of embedded memory and 372 I/O pins to support complex digital designs.

Supplied in a high-density FCBGA package and specified for commercial temperature operation, the device targets systems where integration of logic, memory, and I/O count are primary design drivers.

Key Features

• FPGA Core — Stratix® IV GX architecture providing 105,600 logic elements for large-scale programmable logic implementations.
• On-chip Memory — Approximately 9.79 Mbits of embedded memory to support buffering, lookup tables, and data-storage needs within the FPGA fabric.
• I/O Capacity — 372 user I/O pins to accommodate high pin-count interfaces and multiple parallel connections.
• Power — Operates from a core voltage supply range of 870 mV to 930 mV, enabling defined power planning for system design.
• Package — Supplied in a 780-ball FCBGA format (supplier device package: 780-FBGA, 29×29) suitable for space-constrained, high-density board layouts.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital logic systems — Deploy the FPGA where a large number of logic elements and embedded memory are required to implement complex digital functions and state machines.
• High-I/O interface designs — Use the device in systems that require numerous external connections, leveraging its 372 I/O pins for parallel buses and multi-channel interfaces.
• Data buffering and on-chip storage — Implement buffering, FIFOs, and lookup tables using the approximately 9.79 Mbits of embedded memory.

Unique Advantages

• Large programmable fabric: 105,600 logic elements allow consolidation of multiple functions into a single device, simplifying board-level integration.
• Substantial embedded memory: Approximately 9.79 Mbits of on-chip RAM reduces external memory requirements and shortens data paths.
• High I/O density: 372 I/O pins support multiple external interfaces without additional I/O expanders.
• Compact, high-density package: 780-ball FCBGA (29×29) package enables space-efficient PCB designs for applications with board-area constraints.
• Defined power envelope: Core supply range of 870 mV to 930 mV assists in predictable power-supply design and thermal planning.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with standard commercial product deployment environments.

Why Choose EP4SGX110DF29C4?

The EP4SGX110DF29C4 positions itself as a high-capacity Stratix® IV GX FPGA option for designs that require a combination of large logic resources, significant on-chip memory, and extensive I/O. Its FCBGA packaging and defined voltage and temperature ranges make it suitable for commercial electronic systems where integration and predictable electrical characteristics are important.

This device is well suited for engineering teams and procurement focused on consolidating functions into a single FPGA, minimizing external components, and leveraging Intel’s Stratix IV GX family attributes for robust, scalable designs.

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