EPF10K10TC144-4

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 102 6144 576 144-LQFP

Quantity 729 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10TC144-4 – FLEX-10K® Field Programmable Gate Array, 5.0-V (4.75–5.25 V), 144-LQFP

The EPF10K10TC144-4 is a FLEX-10K family field programmable gate array (FPGA) provided by Intel. It combines a logic array and embedded memory resources to implement glue logic, custom peripherals, and on-chip megafunctions for system-on-programmable-chip integration.

With 576 logic elements, 6,144 bits of embedded RAM and up to 102 user I/O in the 144‑LQFP package, this surface-mount device targets commercial embedded designs that need reconfigurable logic, moderate memory, and flexible I/O in a compact package.

Key Features

  • Logic Capacity  576 logic elements and 72 logic array blocks (LABs) provide the programmable fabric for implementing custom logic and control functions.
  • Embedded Memory  6,144 total RAM bits of on-chip embedded memory for implementing small FIFOs, buffers, and state storage without external RAM.
  • I/O  102 available user I/O pins in the 144‑LQFP package to support parallel interfaces, sensor buses, and peripheral connections.
  • Gate Count  Maximum system gate equivalence of 31,000, enabling integration of moderate-complexity digital functions into a single device.
  • Power and Temperature  Designed for a 5.0-V supply operation with a specified supply range of 4.75 V to 5.25 V and commercial operating temperature from 0 °C to 70 °C.
  • Package & Mounting  144‑lead low‑profile quad flat package (144‑LQFP / 144‑TQFP 20×20) for surface-mount PCB assembly and compact board layouts.
  • In-system Configuration & Test  Series-level features include in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support for device configuration and board-level test without consuming device logic.
  • Series Architecture Enhancements  Family features include dedicated carry and cascade chains, flexible interconnect structure, and built-in low-skew clock distribution to simplify arithmetic functions and improve timing predictability.
  • Development Ecosystem  Supported by Altera development systems for automatic place-and-route and design entry, enabling a streamlined design flow for Windows and supported workstation environments.
  • RoHS Compliant  Device is RoHS compliant for lead-free assembly processes.

Typical Applications

  • Interface Bridging  Use the EPF10K10TC144-4 to implement protocol translation and parallel-to-serial bridging where moderate I/O and on-chip memory are required.
  • Embedded Control  Ideal for control and glue-logic functions in commercial embedded systems, providing reprogrammable logic for evolving firmware and feature updates.
  • Peripheral Integration  Integrate custom peripherals, data buffering and small on-chip state machines to reduce external component count and board complexity.
  • Prototyping and Evaluation  Compact package and familiar development tool support make this device suitable for early-stage prototyping of custom digital logic before scaling to higher-density devices.

Unique Advantages

  • Balanced Logic and Memory  A combination of 576 logic elements and 6,144 bits of embedded RAM lets designers implement both control logic and small data structures on-chip.
  • Compact, Surface‑Mount Package  144‑LQFP footprint provides a high pin count in a board-friendly package for space-constrained commercial products.
  • Reconfigurable Design  In-circuit reconfigurability and JTAG support allow field updates and streamlined production test without consuming additional logic resources.
  • Predictable Arithmetic Building Blocks  Dedicated carry and cascade chains simplify implementation of adders, counters, and high-fan-in logic, reducing design effort and routing overhead.
  • Streamlined Design Flow  Compatibility with the family’s development systems enables automated place-and-route and megafunction support to accelerate design cycles.

Why Choose EPF10K10TC144-4?

The EPF10K10TC144-4 is positioned for commercial embedded designs that require a reprogrammable, mid-density FPGA with moderate on-chip memory and a flexible I/O count in a compact surface-mount package. Its balance of logic elements, embedded RAM and system-level features—such as JTAG boundary-scan and in-system reconfiguration—makes it suitable for designs that benefit from hardware flexibility and iterative development.

This device is a practical choice for teams seeking to reduce board-level BOM and accelerate time-to-market through integrated logic and memory, while using established development tools for synthesis, place-and-route, and verification.

Request a quote or submit a procurement inquiry to obtain pricing, lead-time and availability for EPF10K10TC144-4 for your next embedded design project.

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