EPF10K10QI208-4N

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 1,212 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O134Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10QI208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

The EPF10K10QI208-4N is an EPF10K family FLEX 10K embedded programmable logic device designed for reconfigurable system integration. As a 5.0‑V FLEX 10K device, it combines a dedicated logic array with embedded memory and configurable I/O for industrial applications that require in-field reprogrammability and deterministic logic resources.

With 576 logic elements and 72 LABs paired with 6,144 bits of embedded RAM and up to 134 I/O pins in a 208‑BFQFP surface-mount package, this device is suited to control, interface, and mid-density logic consolidation roles in industrial environments.

Key Features

  • Logic Capacity — 576 logic elements and 72 LABs provide a mid-density programmable fabric suitable for custom combinational and sequential logic implementations.
  • Gate Resources — Maximum system gates listed at 31,000 for EPF10K10 series devices, enabling substantial logic integration without external ASICs.
  • Embedded Memory — 6,144 total RAM bits across embedded array blocks for on-chip data storage and buffering.
  • I/O and Voltage — 134 user I/O pins and a 4.5 V to 5.5 V supply range, matching 5.0‑V device operation in the FLEX 10K family.
  • Package and Mounting — 208‑BFQFP (supplier package: 208‑PQFP, 28×28) in a surface-mount form factor for PCB assembly flexibility.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C, addressing a broad set of industrial operating conditions.
  • Reconfigurability and Test — Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG; built-in IEEE 1149.1 JTAG boundary-scan is available per FLEX 10K family documentation.
  • Clock & Interconnect Options — FLEX 10K family features such as low-skew clock distribution, ClockLock/ClockBoost options, dedicated carry and cascade chains, and FastTrack interconnect support are included in the device family architecture.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Use as mid-density programmable logic for motor control interfaces, discrete I/O aggregation, and machine control state machines within −40 °C to 85 °C environments.
  • Embedded System Integration — Consolidate glue logic, bus interfacing, and peripheral control through on-chip logic and embedded RAM to reduce component count.
  • Interface and I/O Management — Implement custom I/O protocols, buffering, and signal conditioning using 134 user I/Os and configurable output characteristics.
  • Field-Upgradeable Logic — Leverage in-circuit reconfigurability and JTAG boundary-scan for firmware updates and in-field hardware feature changes.

Unique Advantages

  • Balanced Mid-Density Integration: 576 logic elements and 6,144 bits of embedded RAM provide a compact platform to implement complex glue logic and moderate-size custom functions.
  • Industrial-Grade Operating Range: −40 °C to 85 °C rating supports deployment in industrial applications where wide temperature tolerance is required.
  • Flexible Power Envelope: Operation across a 4.5 V to 5.5 V supply range aligns with 5.0‑V system designs and simplifies integration with legacy voltage rails.
  • Surface-Mount 208‑BFQFP Package: 28×28 PQFP package enables denser PCB layouts while maintaining accessible I/O for prototyping and production assemblies.
  • Reconfigurability and Testability: In-circuit reconfiguration options plus built-in JTAG boundary-scan allow easier development iteration and manufacturing test flows.

Why Choose EPF10K10QI208-4N?

The EPF10K10QI208-4N positions itself as a practical, reconfigurable solution for designers needing mid-range logic capacity with on-chip RAM and flexible I/O in an industrial temperature-rated package. Its combination of 576 logic elements, 72 LABs, and 6,144 bits of embedded memory offers the resources to consolidate discrete logic and accelerate time-to-market while retaining the ability to update functionality in the field.

This device is well suited to engineering teams building industrial control, embedded interface, and system integration designs that require deterministic logic, JTAG-based testability, and a 5.0‑V compatible power domain. Backed by the FLEX 10K family architecture, it offers a clear upgrade path within the same device family for designs that may scale in logic or memory requirements.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the EPF10K10QI208-4N. Our team can provide the details you need to evaluate this device for your next design.

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