EPF10K10QC208-3N
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP |
|---|---|
| Quantity | 1,033 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 134 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10QC208-3N – FLEX 10K Field Programmable Gate Array (FPGA) IC, 134 I/O, 576 Logic Elements, 208‑BFQFP
The EPF10K10QC208-3N is a FLEX 10K family FPGA offering embedded programmable logic and memory for system-level integration. As part of the FLEX 10K family, it combines a logic array with embedded memory resources to implement custom logic, megafunctions and system glue logic in a 208‑BFQFP surface‑mount package.
Targeted at commercial‑grade embedded designs, the device provides a balance of on‑chip logic, RAM and I/O for applications that require reconfigurable logic, compact packaging and support for 5.0‑V environments.
Key Features
- Logic Capacity — 576 logic elements providing the programmable fabric for custom digital logic and control functions; supports up to 31,000 system gates.
- Embedded Memory — 6,144 bits of on‑chip RAM for implementing FIFOs, small buffers and megafunction memory blocks.
- I/O Resources — 134 user I/O pins available for interfacing to peripherals and external logic, with family features for programmable output slew‑rate and per‑pin control.
- Voltage and Power — Operates from a 4.75 V to 5.25 V supply and is RoHS compliant; the FLEX 10K family specifies low standby current for reduced power in inactive states.
- Package and Mounting — 208‑BFQFP (Supplier package: 208‑PQFP, 28×28) surface‑mount package suitable for compact board layouts.
- Operating Range — Commercial operating temperature range of 0 °C to 70 °C.
- Family System Features — FLEX 10K family capabilities include an embedded array for megafunctions, JTAG boundary‑scan (IEEE 1149.1), FastTrack continuous routing interconnect, dedicated carry and cascade chains for arithmetic and high‑fan‑in logic, and in‑circuit reconfigurability options.
- Clock and Timing — Built‑in low‑skew clock distribution trees and family options such as ClockLock and ClockBoost for reduced clock skew and clock multiplication.
Typical Applications
- System Integration — Implement SOPC-style megafunctions and glue logic to consolidate discrete components and reduce board complexity.
- Peripheral and Interface Control — Use available I/O and programmable logic to implement custom peripheral controllers, protocol translation and buffering.
- Embedded Memory Functions — Leverage 6,144 bits of embedded RAM for small FIFOs, lookup tables and temporary storage in control logic.
- Custom Logic and Glue — Replace or augment discrete state machines, counters and combinational logic with reconfigurable hardware tailored to application needs.
Unique Advantages
- Balanced logic and memory — 576 logic elements paired with 6,144 bits of RAM provide a compact, self‑contained platform for moderate complexity designs.
- 5 V‑centric compatibility — Rated for 4.75 V to 5.25 V operation to integrate with legacy 5.0‑V systems and boards that require that supply range.
- Flexible I/O control — A substantial count of 134 user I/O pins with per‑pin control features from the FLEX 10K family enables versatile interfacing and signal management.
- Reconfigurability and test — Family support for in‑circuit reconfigurability and IEEE 1149.1 JTAG boundary‑scan facilitates programming, debugging and manufacturing test.
- Compact surface‑mount package — 208‑BFQFP (28×28) surface‑mount footprint offers a space‑efficient solution for board designs needing significant logic capacity in a PQFP form factor.
- Pin‑compatibility across family — FLEX 10K family packages offer pin‑compatibility with other devices in the same package to simplify design scalability within the family.
Why Choose EPF10K10QC208-3N?
The EPF10K10QC208-3N is a FLEX 10K family device that balances moderate logic density, embedded RAM and a healthy I/O count in a compact 208‑BFQFP package. Its 5.0‑V supply range, JTAG support and family‑level interconnect and clocking features make it a practical choice for commercial embedded applications that require reconfigurable logic and on‑chip memory.
Designers seeking to consolidate glue logic, implement small on‑chip memory functions or prototype system-level logic will find this part suitable for scalable designs within the FLEX 10K ecosystem. The part’s surface‑mount packaging and RoHS compliance support standard commercial manufacturing processes.
Request a quote or submit an RFQ to get pricing and availability for the EPF10K10QC208-3N and to evaluate it for your next embedded design.

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