EPF10K10QC208-3N

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 1,033 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O134Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10QC208-3N – FLEX 10K Field Programmable Gate Array (FPGA) IC, 134 I/O, 576 Logic Elements, 208‑BFQFP

The EPF10K10QC208-3N is a FLEX 10K family FPGA offering embedded programmable logic and memory for system-level integration. As part of the FLEX 10K family, it combines a logic array with embedded memory resources to implement custom logic, megafunctions and system glue logic in a 208‑BFQFP surface‑mount package.

Targeted at commercial‑grade embedded designs, the device provides a balance of on‑chip logic, RAM and I/O for applications that require reconfigurable logic, compact packaging and support for 5.0‑V environments.

Key Features

  • Logic Capacity — 576 logic elements providing the programmable fabric for custom digital logic and control functions; supports up to 31,000 system gates.
  • Embedded Memory — 6,144 bits of on‑chip RAM for implementing FIFOs, small buffers and megafunction memory blocks.
  • I/O Resources — 134 user I/O pins available for interfacing to peripherals and external logic, with family features for programmable output slew‑rate and per‑pin control.
  • Voltage and Power — Operates from a 4.75 V to 5.25 V supply and is RoHS compliant; the FLEX 10K family specifies low standby current for reduced power in inactive states.
  • Package and Mounting — 208‑BFQFP (Supplier package: 208‑PQFP, 28×28) surface‑mount package suitable for compact board layouts.
  • Operating Range — Commercial operating temperature range of 0 °C to 70 °C.
  • Family System Features — FLEX 10K family capabilities include an embedded array for megafunctions, JTAG boundary‑scan (IEEE 1149.1), FastTrack continuous routing interconnect, dedicated carry and cascade chains for arithmetic and high‑fan‑in logic, and in‑circuit reconfigurability options.
  • Clock and Timing — Built‑in low‑skew clock distribution trees and family options such as ClockLock and ClockBoost for reduced clock skew and clock multiplication.

Typical Applications

  • System Integration — Implement SOPC-style megafunctions and glue logic to consolidate discrete components and reduce board complexity.
  • Peripheral and Interface Control — Use available I/O and programmable logic to implement custom peripheral controllers, protocol translation and buffering.
  • Embedded Memory Functions — Leverage 6,144 bits of embedded RAM for small FIFOs, lookup tables and temporary storage in control logic.
  • Custom Logic and Glue — Replace or augment discrete state machines, counters and combinational logic with reconfigurable hardware tailored to application needs.

Unique Advantages

  • Balanced logic and memory — 576 logic elements paired with 6,144 bits of RAM provide a compact, self‑contained platform for moderate complexity designs.
  • 5 V‑centric compatibility — Rated for 4.75 V to 5.25 V operation to integrate with legacy 5.0‑V systems and boards that require that supply range.
  • Flexible I/O control — A substantial count of 134 user I/O pins with per‑pin control features from the FLEX 10K family enables versatile interfacing and signal management.
  • Reconfigurability and test — Family support for in‑circuit reconfigurability and IEEE 1149.1 JTAG boundary‑scan facilitates programming, debugging and manufacturing test.
  • Compact surface‑mount package — 208‑BFQFP (28×28) surface‑mount footprint offers a space‑efficient solution for board designs needing significant logic capacity in a PQFP form factor.
  • Pin‑compatibility across family — FLEX 10K family packages offer pin‑compatibility with other devices in the same package to simplify design scalability within the family.

Why Choose EPF10K10QC208-3N?

The EPF10K10QC208-3N is a FLEX 10K family device that balances moderate logic density, embedded RAM and a healthy I/O count in a compact 208‑BFQFP package. Its 5.0‑V supply range, JTAG support and family‑level interconnect and clocking features make it a practical choice for commercial embedded applications that require reconfigurable logic and on‑chip memory.

Designers seeking to consolidate glue logic, implement small on‑chip memory functions or prototype system-level logic will find this part suitable for scalable designs within the FLEX 10K ecosystem. The part’s surface‑mount packaging and RoHS compliance support standard commercial manufacturing processes.

Request a quote or submit an RFQ to get pricing and availability for the EPF10K10QC208-3N and to evaluate it for your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up