EPF10K10QC208-3

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 819 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O134Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10QC208-3 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

The EPF10K10QC208-3 is a FLEX 10K family programmable logic device that combines a general-purpose logic array with embedded memory resources for system-level integration. This commercial-grade, surface-mount device provides 576 logic elements and approximately 6,144 bits of on-chip RAM to implement custom logic and memory-intensive megafunctions.

With 134 user I/Os, a package size suited for board-level designs (208-BFQFP / 208-PQFP 28×28), and 5.0 V nominal supply operation (4.75 V to 5.25 V), the device targets embedded systems, interface bridging and prototype designs that require integrated logic, embedded memory and flexible I/O in a single component.

Key Features

  • Logic Capacity  576 logic elements and a typical device gate count supporting up to 31,000 gates, enabling moderate-complexity custom logic implementations.
  • Embedded Memory  Approximately 6,144 bits of on-chip RAM suitable for small buffers, register files or megafunctions without reducing logic capacity.
  • I/O Flexibility  134 user I/O pins provide broad interface options for peripheral control, data routing and board-level connectivity.
  • Configuration & Test  Supports in-circuit reconfigurability via external configuration device, intelligent controller or JTAG port; includes built-in IEEE 1149.1 JTAG boundary-scan test circuitry.
  • Clocking & Performance  Family-level features include dedicated carry and cascade chains for efficient arithmetic and high-fan-in functions, plus support for multiple global clocks and clock distribution options.
  • Power & Supply  Designed for 5.0 V nominal systems with a specified operating supply range of 4.75 V to 5.25 V; low-power family options are documented in the FLEX 10K series literature.
  • Package & Mounting  208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for standard PCB assembly processes.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 70 °C and RoHS compliant for lead-free assembly requirements.

Typical Applications

  • Embedded Systems  Use as a configurable logic and memory element to implement custom control, data aggregation or protocol handling within embedded designs.
  • Prototyping & Development  Rapidly prototype digital logic and verify system functions using in-circuit reconfiguration and JTAG access for iterative development.
  • Peripheral Interfacing  Implement glue logic, bus bridging or custom I/O adaptation leveraging 134 user I/Os and programmable output controls.
  • Memory-Backed Logic  Integrate small on-chip memory structures with logic to create FIFOs, small buffers or lookup tables for data-path acceleration.

Unique Advantages

  • Embedded Logic plus Memory:  Combines 576 logic elements with ~6,144 bits of embedded RAM so you can implement both control logic and local data storage on a single device.
  • Flexible I/O Count:  134 user-accessible I/O pins allow extensive peripheral connections and board-level interfacing without additional bridge components.
  • Standard 5 V Operation:  Designed for 5.0 V systems (4.75 V–5.25 V), simplifying integration into legacy and existing 5 V designs.
  • In-Circuit Reconfigurability & JTAG:  Supports multiple configuration methods and includes IEEE 1149.1 boundary-scan for device test and reprogramming in-system.
  • Surface-Mount 208-BFQFP Package:  Compact PQFP footprint (28×28 supplier package) balances I/O density and manufacturability for standard PCB assembly.
  • RoHS Compliant:  Meets lead-free assembly requirements for regulatory and supply-chain compatibility.

Why Choose EPF10K10QC208-3?

The EPF10K10QC208-3 delivers a practical balance of logic resources, embedded RAM and I/O density for designers building moderate-complexity programmable logic into 5 V systems. Its FLEX 10K family capabilities—such as embedded memory blocks, dedicated arithmetic resources and in-circuit reconfigurability—support system-on-chip style integration and iterative development workflows.

This device is well suited to teams that need a commercial-temperature, RoHS-compliant programmable device in a standard 208-pin surface-mount package, with straightforward power requirements and on-board configuration/test options for efficient board-level integration and development.

Request a quote or submit a product inquiry to start procurement or to get more information about availability and lead times for EPF10K10QC208-3.

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