EPF10K10QC208-4N

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 280 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O134Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10QC208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

The EPF10K10QC208-4N is a FLEX 10K family field programmable gate array (FPGA) intended for embedded programmable-logic designs. It provides a balance of general-purpose logic and embedded memory to implement custom logic, megafunctions, and system integration tasks.

With 576 logic elements, approximately 6,144 bits of embedded RAM, and 134 user I/O pins in a 208-pin BFQFP surface-mount package, this device supports designs that require moderate logic capacity, on-chip memory, and versatile I/O in a commercial-grade footprint.

Key Features

  • Core Logic  Provides 576 logic elements and a device gate count reported as 31,000 system gates for implementing custom logic and control functions.
  • Embedded Memory  Approximately 6,144 bits of on-chip RAM suitable for small buffers, FIFOs, and state/storage resources within a design.
  • I/O Capacity  134 available user I/O pins to support multiple interfaces, signal domains, and board-level glue logic in complex embedded systems.
  • Supply and Operating Range  Designed for a 4.75 V to 5.25 V supply range with a commercial operating temperature range of 0 °C to 70 °C.
  • Package & Mounting  208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level deployment where a high-pin-count QFP is required.
  • Family-level System Features  FLEX 10K family capabilities include embedded arrays for efficient memory and specialized logic functions, in-circuit reconfigurability options, built-in JTAG boundary-scan for test, and flexible interconnect features described in the family datasheet.
  • Standards & Compliance  RoHS compliant material designation for environmental regulatory alignment.

Typical Applications

  • Embedded Control and SOPC Integration  Implement custom control logic and system-on-a-programmable-chip (SOPC) integration where embedded logic and memory reduce external component count.
  • Interface and Glue Logic  Provide protocol translation, bus interfacing, and signal conditioning with abundant I/O and programmable logic to adapt between subsystems.
  • On-chip Memory Functions  Use embedded RAM for small data buffers, FIFOs, and temporary storage close to logic for improved design compactness.
  • Prototyping and Development  Evaluate and iterate moderate-complexity digital logic designs in a commercially graded package and temperature range.

Unique Advantages

  • Moderate Logic Density:  576 logic elements and a device gate count appropriate for designs needing sizable but not top-tier gate resources.
  • On-chip Memory Integration:  Approximately 6,144 bits of embedded RAM reduces the need for small external memory components and simplifies board design.
  • Generous I/O:  134 user I/O pins enable multiple interface connections and flexible pin assignments for board-level system integration.
  • Commercial-grade Availability:  Designed for standard commercial temperature operation (0 °C to 70 °C) and 5 V supply environments common in many embedded systems.
  • Testability and Reconfigurability:  Family-level features include JTAG boundary-scan for test and options for in-circuit reconfigurability referenced in the FLEX 10K datasheet, aiding production test and field-upgrade strategies.
  • RoHS Compliance:  RoHS status compliant, supporting environmental and manufacturing requirements.

Why Choose EPF10K10QC208-4N?

The EPF10K10QC208-4N positions itself as a practical FPGA choice for mid-density embedded designs that require a combination of logic, embedded RAM, and extensive I/O in a 208-pin QFP package. Its FLEX 10K family heritage brings architecture and system-level features—such as embedded arrays, in-circuit reconfigurability options, and boundary-scan testability—that help simplify board-level integration and development.

This device is suited for engineers and teams building control logic, interface glue, and memory-backed logic functions within commercial temperature environments. Backed by the FLEX 10K family documentation and development tool support referenced in the datasheet, it offers a clear upgrade path within the same family for projects that may scale in complexity.

Request a quote or submit a pricing inquiry to receive availability, lead-time, and ordering information for the EPF10K10QC208-4N.

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