EPF10K10QI208-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP |
|---|---|
| Quantity | 1,868 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 134 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K10QI208-4 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP
The EPF10K10QI208-4 is an Intel FLEX 10K family field programmable gate array optimized for embedded programmable logic and system-level integration. It combines a dedicated logic array and embedded memory resources to implement megafunctions, glue logic, and custom peripheral functions within a single device.
Designed for industrial applications, this surface-mount FPGA offers mid-range density with 576 logic elements, 6,144 bits of embedded RAM, and 134 user I/O pins in a 208-BFQFP package, operating over a 4.5 V to 5.5 V supply and an operating temperature range of −40 °C to 85 °C.
Key Features
- Logic Capacity — 576 logic elements and 72 logic array blocks (LABs) for implementing combinational and sequential logic functions; listed maximum system gates up to 31,000.
- Embedded Memory — 6,144 bits of on-chip RAM suitable for small data buffers, state storage, and megafunctions.
- I/O and Packaging — 134 user I/O pins in a 208-BFQFP (208‑PQFP, 28×28) surface-mount package for dense board-level integration.
- Power and Temperature — Operates from 4.5 V to 5.5 V with industrial-grade operating temperature from −40 °C to 85 °C.
- Reconfigurability and Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (IEEE 1149.1) available without consuming device logic.
- Interconnect and Arithmetic Support — FastTrack continuous routing, dedicated carry and cascade chains for fast arithmetic and high-fan-in logic; tri-state emulation for internal bus structures.
- Clocking — Built-in low-skew clock distribution with ClockLock and ClockBoost options for reduced clock delay/skew and clock multiplication (family-level features).
- I/O Flexibility — Individual tri-state output enable per pin, open-drain option, and programmable output slew-rate control for signal integrity management.
- Compliance — RoHS compliant.
Typical Applications
- System-on-a-Programmable-Chip (SOPC) Integration — Embedded array and logic array can implement megafunctions and consolidate multiple discrete components into a single programmable device.
- On-board Memory and Buffers — 6,144 bits of embedded RAM used for small FIFOs, buffering, and temporary data storage in embedded controllers and I/O subsystems.
- Peripheral and Bus Logic — Implement custom bus adapters, protocol bridging, and glue logic; FLEX 10K family devices include features for peripheral bus support where specified by the family data.
- Industrial Control and Interface — Industrial-temperature operation and a high pin count in a compact PQFP package suit control logic, sensor interfacing, and human‑machine interface circuits.
Unique Advantages
- Balanced Mid-Range Density: 576 logic elements and up to 31,000 system gates provide a practical balance of logic capacity and cost for medium-complexity designs.
- Integrated On-Chip Memory: 6,144 bits of embedded RAM reduce the need for external memory for small buffering and state storage, lowering BOM and board area.
- Flexible I/O and Packaging: 134 user I/O in a 208-BFQFP surface-mount package simplifies routing while maintaining high connectivity for peripheral devices.
- Industrial Reliability: Specified for −40 °C to 85 °C operation and RoHS compliance to meet industrial deployment requirements.
- Design and Test Support: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support simplify programming, debug, and production test flows.
- Dedicated Arithmetic and Routing Resources: Carry and cascade chains plus FastTrack routing streamline implementation of adders, counters, and high-speed logic functions.
Why Choose EPF10K10QI208-4?
The EPF10K10QI208-4 delivers a practical, industrial-grade FPGA option for designs that require moderate logic capacity, embedded memory, and a high I/O count in a compact PFQFP package. Its combination of reconfigurability, on-chip RAM, and dedicated arithmetic and routing resources makes it well suited for embedded system integration, interface logic, and control applications.
Engineers and procurement teams will find the EPF10K10QI208-4 appropriate for projects that need predictable, board-level integration with industry-standard test and programming support while operating across an industrial temperature range.
Request a quote or submit an inquiry to purchase the EPF10K10QI208-4 and discuss availability and lead times with our sales team.

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