EPF10K10QI208-4

IC FPGA 134 I/O 208QFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

Quantity 1,868 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O134Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K10QI208-4 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 134 6144 576 208-BFQFP

The EPF10K10QI208-4 is an Intel FLEX 10K family field programmable gate array optimized for embedded programmable logic and system-level integration. It combines a dedicated logic array and embedded memory resources to implement megafunctions, glue logic, and custom peripheral functions within a single device.

Designed for industrial applications, this surface-mount FPGA offers mid-range density with 576 logic elements, 6,144 bits of embedded RAM, and 134 user I/O pins in a 208-BFQFP package, operating over a 4.5 V to 5.5 V supply and an operating temperature range of −40 °C to 85 °C.

Key Features

  • Logic Capacity — 576 logic elements and 72 logic array blocks (LABs) for implementing combinational and sequential logic functions; listed maximum system gates up to 31,000.
  • Embedded Memory — 6,144 bits of on-chip RAM suitable for small data buffers, state storage, and megafunctions.
  • I/O and Packaging — 134 user I/O pins in a 208-BFQFP (208‑PQFP, 28×28) surface-mount package for dense board-level integration.
  • Power and Temperature — Operates from 4.5 V to 5.5 V with industrial-grade operating temperature from −40 °C to 85 °C.
  • Reconfigurability and Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (IEEE 1149.1) available without consuming device logic.
  • Interconnect and Arithmetic Support — FastTrack continuous routing, dedicated carry and cascade chains for fast arithmetic and high-fan-in logic; tri-state emulation for internal bus structures.
  • Clocking — Built-in low-skew clock distribution with ClockLock and ClockBoost options for reduced clock delay/skew and clock multiplication (family-level features).
  • I/O Flexibility — Individual tri-state output enable per pin, open-drain option, and programmable output slew-rate control for signal integrity management.
  • Compliance — RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) Integration — Embedded array and logic array can implement megafunctions and consolidate multiple discrete components into a single programmable device.
  • On-board Memory and Buffers — 6,144 bits of embedded RAM used for small FIFOs, buffering, and temporary data storage in embedded controllers and I/O subsystems.
  • Peripheral and Bus Logic — Implement custom bus adapters, protocol bridging, and glue logic; FLEX 10K family devices include features for peripheral bus support where specified by the family data.
  • Industrial Control and Interface — Industrial-temperature operation and a high pin count in a compact PQFP package suit control logic, sensor interfacing, and human‑machine interface circuits.

Unique Advantages

  • Balanced Mid-Range Density: 576 logic elements and up to 31,000 system gates provide a practical balance of logic capacity and cost for medium-complexity designs.
  • Integrated On-Chip Memory: 6,144 bits of embedded RAM reduce the need for external memory for small buffering and state storage, lowering BOM and board area.
  • Flexible I/O and Packaging: 134 user I/O in a 208-BFQFP surface-mount package simplifies routing while maintaining high connectivity for peripheral devices.
  • Industrial Reliability: Specified for −40 °C to 85 °C operation and RoHS compliance to meet industrial deployment requirements.
  • Design and Test Support: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support simplify programming, debug, and production test flows.
  • Dedicated Arithmetic and Routing Resources: Carry and cascade chains plus FastTrack routing streamline implementation of adders, counters, and high-speed logic functions.

Why Choose EPF10K10QI208-4?

The EPF10K10QI208-4 delivers a practical, industrial-grade FPGA option for designs that require moderate logic capacity, embedded memory, and a high I/O count in a compact PFQFP package. Its combination of reconfigurability, on-chip RAM, and dedicated arithmetic and routing resources makes it well suited for embedded system integration, interface logic, and control applications.

Engineers and procurement teams will find the EPF10K10QI208-4 appropriate for projects that need predictable, board-level integration with industry-standard test and programming support while operating across an industrial temperature range.

Request a quote or submit an inquiry to purchase the EPF10K10QI208-4 and discuss availability and lead times with our sales team.

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