EPF10K130EBC356-1

The EPF10K130EBC356-1 is a commercial-grade FLEX-10KE field programmable gate array (FPGA) from Intel, delivered in a 356-LBGA package. This device integrates a logic array alongside embedded memory resources and is designed for applications requiring high I/O count and reconfigurable logic in a surface-mount BGA footprint.

Built on the FLEX 10K family architecture, the device targets system integration and prototyping tasks where on-chip RAM, a large number of I/O pins, and flexible configuration options are required.

Key Features

• Logic Capacity The device provides 6,656 logic elements and 832 logic array blocks, enabling complex combinational and sequential logic implementations.
• On‑chip Memory Approximately 65,536 bits of embedded RAM for LUT-based storage and megafunction implementations.
• High I/O Count 274 user I/O pins to support dense peripheral interfaces and board-level connectivity.
• Gate Equivalent Documented device gate count of 342,000, reflecting available logic and routing resources for system functions.
• Package and Mounting 356-LBGA (supplier device package: 356-BGA, 35×35) in a surface-mount form factor for compact PCB designs.
• Power Operating supply voltage range specified at 2.375 V to 2.625 V.
• Temperature and Grade Commercial grade operation with an ambient temperature range of 0 °C to 70 °C.
• Reconfigurability and Series Capabilities As part of the FLEX 10K family, the series includes features such as in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support (series-level capability documented in the FLEX 10K data sheet).
• Regulatory RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Systems — Implement control logic and onboard processing functions where reconfigurable logic and on-chip memory reduce external component count.
• System Prototyping and Development — Use in lab and development environments for rapid iteration and in-circuit reconfiguration during design validation.
• Communications and Peripheral Interface — High I/O count supports bridging, protocol translation, and peripheral interfacing in commercial communications equipment.
• Consumer and Commercial Electronics — Integrate customized logic functions and user interface control in commercial-grade products operating within the specified temperature range.

Unique Advantages

• Balanced Logic and Memory — 6,656 logic elements combined with ~65 Kbits of embedded RAM deliver a practical balance for implementing state machines, buffering, and small-data storage without external RAM.
• High Pin Density — 274 I/Os allow flexible system connectivity and reduce the need for external interface ICs.
• Compact BGA Package — 356-LBGA (35×35) package provides a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
• Commercial Temperature Suitability — Specified 0 °C to 70 °C operating range for mainstream commercial applications and environments.
• RoHS Compliant — Meets lead-free manufacturing requirements for modern production processes.
• Reconfigurability — FLEX 10K family features such as in-circuit reconfigurability and JTAG support enable flexible deployment and field updates (series-level features documented in the FLEX 10K data sheet).

Why Choose EPF10K130EBC356-1?

The EPF10K130EBC356-1 offers a practical combination of logic capacity, embedded memory, and extensive I/O in a compact 356-LBGA surface-mount package. It suits commercial-grade designs that require reconfigurable logic, moderate on-chip RAM, and a high density of user I/O while operating at a 2.375–2.625 V supply.

This part is appropriate for engineers and teams developing embedded systems, prototyping hardware, and commercial electronic products that benefit from the FLEX 10K family’s series-level capabilities such as in-circuit reconfigurability and boundary-scan support.

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