EPF10K130EBC356-1X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 274 356-LBGA |
|---|---|
| Quantity | 888 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 6656 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of EPF10K130EBC356-1X – FLEX-10KE® FPGA, 274 I/O, 356-LBGA
The EPF10K130EBC356-1X is a FLEX-10KE® Field Programmable Gate Array (FPGA) IC supplied in a 356-LBGA package. It provides programmable logic and on-chip RAM in a commercial-grade device targeted at general-purpose programmable logic applications.
Key on-chip resources include approximately 6,656 logic elements and 65,536 bits of embedded RAM, paired with 274 user I/O pins. The device supports a VCC supply range of 2.375 V to 2.625 V, operates over a commercial temperature range of 0 °C to 70 °C, and is delivered in a 356-BGA (35×35 mm) surface-mount package. The device is RoHS compliant.
Key Features
- Logic Capacity Approximately 6,656 logic elements suitable for medium-density programmable logic implementations.
- Embedded Memory 65,536 bits of on-chip RAM (approximately 0.0655 Mbits) for buffering, small FIFOs, and state storage.
- I/O Count 274 general-purpose I/O pins to support extensive external interfacing and system integration.
- Power Supply Operates from a nominal supply range of 2.375 V to 2.625 V for core power planning and power-sequencing considerations.
- Package and Mounting 356-LBGA package (supplier device package: 356-BGA, 35×35 mm) in a surface-mount form factor for PCB assembly.
- Temperature and Grade Commercial-grade device rated for 0 °C to 70 °C operation.
- Environmental Compliance RoHS compliant to support lead-free manufacturing processes.
Unique Advantages
- Balanced logic and memory resources: The combination of ~6,656 logic elements and 65,536 bits of RAM supports mixed logic and small-data buffering needs without external memory for many designs.
- High I/O count: 274 I/O pins enable broad connectivity to peripherals, sensors, and external devices, simplifying board-level routing.
- Compact BGA packaging: The 356-LBGA (35×35) surface-mount package delivers a high-pin-count footprint while conserving board area.
- Commercial deployment ready: Rated for 0 °C to 70 °C and RoHS compliant, suitable for commercial electronics production environments.
- Controlled core supply range: The defined 2.375–2.625 V core supply simplifies power-supply design and integration with standard voltage rails.
Why Choose EPF10K130EBC356-1X?
The EPF10K130EBC356-1X positions itself as a commercial-grade, medium-density programmable logic device that combines a substantial logic element count, embedded RAM, and a high I/O complement within a compact 356-LBGA package. Its electrical and thermal ratings allow straightforward integration into commercial electronic systems requiring on‑board programmable logic and moderate memory.
This device is well suited to design teams seeking a RoHS-compliant FPGA with clear supply and temperature specifications, a large I/O footprint, and sufficient on-chip resources to implement control logic, interfacing, and data buffering without immediate reliance on external memory.
Request a quote to discuss pricing, availability, and delivery lead times for EPF10K130EBC356-1X or to submit a procurement inquiry with your quantity and target delivery date.

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