EPF10K130EBI356-2

The EPF10K130EBI356-2 is an Intel FLEX 10K family FPGA optimized for embedded programmable logic and system integration. It combines an embedded array for megafunctions with a general-purpose logic array to support memory-intensive and I/O-dense designs in industrial applications.

This device delivers a balance of logic capacity, on-chip RAM, and a high I/O count for applications requiring reconfigurable logic, specialized memory functions, and robust I/O interfacing within a compact 356-LBGA package.

Key Features

• Logic Capacity — 6,656 logic elements provide programmable logic resources suitable for mid-density designs; the device specification also lists 342,000 gates.
• Embedded Memory — Approximately 65,536 bits of on-chip RAM to implement efficient memory megafunctions and buffering without external RAM.
• I/O Density — 274 user I/O pins to support diverse peripheral interfacing and high-pin-count system connectivity.
• Family-level System Features — FLEX 10K family capabilities include an embedded array for megafunctions, in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port, and built-in JTAG boundary-scan (IEEE Std. 1149.1-1990).
• Interconnect and Arithmetic Support — FastTrack continuous routing structure, dedicated carry chain and cascade chain for efficient arithmetic and high-fan-in logic functions (as provided by the FLEX 10K family).
• Clock and Control — Low-skew clock distribution and support for multiple global clock/clear signals (family-level feature) to simplify clocking strategies.
• Package and Mounting — 356-LBGA (356-BGA, 35×35) surface-mount package for compact board-level integration.
• Power and Operating Range — Supply voltage range 2.375 V to 2.625 V and industrial operating temperature from −40 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• System Integration / SOPC — Implement system-on-a-programmable-chip architectures using the embedded array for megafunctions and the programmable logic fabric for glue and control logic.
• Embedded Memory Functions — Use the on-chip RAM for buffering, FIFOs, and memory-intensive megafunctions to reduce external memory requirements.
• High-Density I/O Interfaces — Drive complex peripheral interfaces, protocol bridging, or multi-channel sensor/actuator I/O with the device’s 274 I/O pins.
• Industrial Control — Deploy reconfigurable control logic and deterministic arithmetic functions within the industrial temperature range.

Unique Advantages

• Balanced Logic and Memory: 6,656 logic elements paired with ~65,536 bits of embedded RAM let you implement both control logic and memory-intensive functions on a single device.
• High I/O Count: 274 I/O pins provide flexibility to connect multiple peripherals or interfaces without additional expansion hardware.
• Family-proven System Features: FLEX 10K family capabilities such as in-circuit reconfigurability and JTAG boundary-scan simplify development, testing, and field updates.
• Compact BGA Package: The 356-LBGA (35×35) package enables higher board density and efficient use of PCB area for space-constrained designs.
• Industrial Temperature Rating: −40 °C to 85 °C operation supports deployment in a wide range of industrial environments.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EPF10K130EBI356-2?

The EPF10K130EBI356-2 positions itself as a practical mid-density FPGA choice within the FLEX 10K family, offering a mix of programmable logic, embedded RAM, and abundant I/O in a compact BGA package. Its family-level features for reconfiguration, clock distribution, and optimized interconnect support system-level integration and reduce external component count.

This device is suited for engineers designing industrial embedded systems, interface-rich controllers, and memory-aware logic subsystems who require field reconfigurability, a robust operating temperature range, and RoHS compliance.

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