EPF10K130EFC484-2N

The EPF10K130EFC484-2N is a FLEX-10KE field programmable gate array (FPGA) IC designed for mid-range programmable-logic integration. The device combines a logic array and embedded memory resources to implement megafunctions and general-purpose logic within a single, reconfigurable device.

This commercial-grade, RoHS-compliant device offers a balance of logic capacity, embedded RAM, and I/O density for system-level applications that require in-system reconfigurability, boundary-scan test access, and compact BGA packaging.

Key Features

• Core architecture  Embedded array for implementing megafunctions and a separate logic array for general logic functions, enabling System-on-a-Programmable-Chip (SOPC) integration as described for the FLEX 10K family.
• Logic capacity  Approximately 6,656 logic elements implemented across 832 LABs, providing substantial programmable logic resources.
• Embedded memory  Total on-chip RAM of 65,536 bits for data buffering, state storage, and memory-based functions.
• I/O density and flexibility  369 user I/O pins with series I/O capabilities described in the FLEX 10K family, including individual tri-state control, open-drain options, and programmable output slew-rate control.
• System and test features  Built-in JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1 for board-level test and in-circuit reconfigurability.
• Power and supply  Operates from a supply range of 2.375 V to 2.625 V.
• Package and mounting  484-ball BGA package (484-BBGA; supplier package 484-FBGA 23×23) for surface-mount assembly and high board-area efficiency.
• Operating environment  Commercial temperature grade with an operating range of 0 °C to 70 °C; RoHS compliant.

Typical Applications

• System integration and SOPC implementations  Use the embedded array and logic fabric to consolidate custom peripherals, glue logic, and megafunctions into a programmable system block.
• Memory-backed logic functions  Implement buffers, FIFOs, or small embedded-data stores using the device’s 65,536 bits of on-chip RAM.
• I/O consolidation and protocol bridging  Leverage 369 I/Os and programmable I/O features to combine multiple interface signals or create custom protocol adapters.
• Board-level test and reconfiguration  Use built-in JTAG boundary-scan for production test and to support in-circuit reconfiguration workflows.

Unique Advantages

• High programmable logic density: 6,656 logic elements across 832 LABs provide the resources needed for complex glue logic and mid-range FPGA functions.
• Substantial embedded memory: 65,536 bits of on-chip RAM reduce the need for external memory in many buffering and lookup applications.
• Large I/O count with flexible options: 369 user I/Os and programmable output features enable dense I/O mapping and signal-conditioning choices on a per-pin basis.
• Compact BGA packaging: 484-ball BGA (484-FBGA 23×23) delivers high pin count in a space-efficient surface-mount form factor.
• Built-in test and reconfiguration: IEEE-1149.1 JTAG boundary-scan support and in-circuit reconfigurability simplify board debug, programming, and production test.
• RoHS-compliant commercial solution: Commercial operating range and RoHS compliance help meet common regulatory and assembly requirements.

Why Choose EPF10K130EFC484-2N?

The EPF10K130EFC484-2N positions itself as a flexible, reconfigurable building block for designs that need a combination of logic density, embedded memory, and substantial I/O capacity in a compact BGA package. Its support for in-system reconfiguration and JTAG boundary-scan makes it suitable for development, prototyping, and production applications where board-level testability and configurability matter.

This device is well suited to engineers building mid-range programmable logic solutions who require a commercially graded, RoHS-compliant FPGA with defined supply and temperature limits, and who value the integration of embedded memory and extensive I/O in a single component.

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