EPF10K130EFC484-3N
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA |
|---|---|
| Quantity | 1,104 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 369 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 6656 | ||
| Number of Gates | 342000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of EPF10K130EFC484-3N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA
The EPF10K130EFC484-3N is a FLEX 10K family programmable logic device optimized for mid-to-high density system integration. It combines a logic array and embedded memory to implement complex logic, on-chip RAM-based functions, and high-pin-count I/O in a compact surface-mount BGA package.
Designed for commercial applications, this device targets system designers who need flexible programmable logic, abundant I/O, and a mature development ecosystem for functions such as megafunction integration, custom peripheral logic, and board-level interfacing.
Key Features
- Logic Capacity — 6,656 logic elements and 832 LABs for implementing complex digital logic and control functions.
- Embedded Memory — 65,536 bits of total on-chip RAM (approximately 0.064 Mbits) to support FIFOs, small buffers, and memory-based megafunctions.
- High I/O Count — 369 user I/O pins to support extensive board-level connectivity and parallel interfaces.
- Gate Scale — Listed at 342,000 gates to indicate the device’s integration scale for combined logic and memory resources.
- Package & Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount package for dense board integration and improved routing efficiency.
- Voltage & Power — Core supply range 2.375 V to 2.625 V to match system power rails and enable predictable power planning.
- Temperature & Grade — Commercial temperature range 0 °C to 70 °C suitable for standard embedded and consumer applications.
- Standards & Test — Family-level JTAG boundary-scan (IEEE 1149.1) support for in-system test and configuration.
- Flexible Architecture — Family features include dedicated carry and cascade chains, low-skew clock distribution, and continuous routing topology to support arithmetic, high-fan-in logic, and predictable timing (as described in the FLEX 10K family documentation).
- Compliance — RoHS compliant, supporting lead-free manufacturing flows.
Typical Applications
- System Integration / SOPC — Implement custom system-on-a-programmable-chip architectures, combining control logic, interfaces, and small embedded memories.
- Interface & Peripherals — Manage parallel and serial peripheral interfaces using the device’s high I/O count and programmable I/O features.
- Memory-Based Functions — Use on-chip RAM for FIFOs, small data buffers, and megafunction implementations that reduce external memory needs.
- Custom Logic Acceleration — Offload repetitive arithmetic and combinational tasks to dedicated carry/cascade chains and the logic array for improved system determinism.
Unique Advantages
- Substantial Logic Density: 6,656 logic elements and 832 LABs provide a compact platform for medium-complexity designs without moving to larger families.
- Ample On-Chip RAM: 65,536 bits of embedded memory reduce dependence on external memory for buffering and megafunctions, simplifying BOM and board routing.
- High Pin Count: 369 I/O pins enable multiple parallel buses and rich peripheral connectivity from a single device package.
- Surface-Mount BGA Packaging: 484-ball 23×23 FBGA delivers high interconnect density and a smaller PCB footprint for space-constrained designs.
- Mature Family-Level Features: JTAG boundary-scan, dedicated carry/cascade chains, and low-skew clock trees (documented for the FLEX 10K family) facilitate faster bring-up and reliable timing.
- RoHS Compliance: Supports lead-free assembly processes and aligns with common environmental requirements.
Why Choose EPF10K130EFC484-3N?
The EPF10K130EFC484-3N provides a balanced combination of logic capacity, embedded RAM, and high I/O in a commercial-grade FLEX 10K device. Its architecture and family-level features support integration of megafunctions and complex custom logic while keeping board-level footprint compact thanks to the 484-ball BGA.
This device is well suited to design teams building consumer and embedded systems that require scalable programmable logic, considerable on-chip memory, and extensive I/O without moving to higher-cost, higher-power alternatives. The FLEX 10K family documentation and development support make it practical to integrate this device reliably into production designs.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EPF10K130EFC484-3N.

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