EPF10K130EFC484-3N

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA

Quantity 1,104 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells6656
Number of Gates342000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of EPF10K130EFC484-3N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA

The EPF10K130EFC484-3N is a FLEX 10K family programmable logic device optimized for mid-to-high density system integration. It combines a logic array and embedded memory to implement complex logic, on-chip RAM-based functions, and high-pin-count I/O in a compact surface-mount BGA package.

Designed for commercial applications, this device targets system designers who need flexible programmable logic, abundant I/O, and a mature development ecosystem for functions such as megafunction integration, custom peripheral logic, and board-level interfacing.

Key Features

  • Logic Capacity — 6,656 logic elements and 832 LABs for implementing complex digital logic and control functions.
  • Embedded Memory — 65,536 bits of total on-chip RAM (approximately 0.064 Mbits) to support FIFOs, small buffers, and memory-based megafunctions.
  • High I/O Count — 369 user I/O pins to support extensive board-level connectivity and parallel interfaces.
  • Gate Scale — Listed at 342,000 gates to indicate the device’s integration scale for combined logic and memory resources.
  • Package & Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount package for dense board integration and improved routing efficiency.
  • Voltage & Power — Core supply range 2.375 V to 2.625 V to match system power rails and enable predictable power planning.
  • Temperature & Grade — Commercial temperature range 0 °C to 70 °C suitable for standard embedded and consumer applications.
  • Standards & Test — Family-level JTAG boundary-scan (IEEE 1149.1) support for in-system test and configuration.
  • Flexible Architecture — Family features include dedicated carry and cascade chains, low-skew clock distribution, and continuous routing topology to support arithmetic, high-fan-in logic, and predictable timing (as described in the FLEX 10K family documentation).
  • Compliance — RoHS compliant, supporting lead-free manufacturing flows.

Typical Applications

  • System Integration / SOPC — Implement custom system-on-a-programmable-chip architectures, combining control logic, interfaces, and small embedded memories.
  • Interface & Peripherals — Manage parallel and serial peripheral interfaces using the device’s high I/O count and programmable I/O features.
  • Memory-Based Functions — Use on-chip RAM for FIFOs, small data buffers, and megafunction implementations that reduce external memory needs.
  • Custom Logic Acceleration — Offload repetitive arithmetic and combinational tasks to dedicated carry/cascade chains and the logic array for improved system determinism.

Unique Advantages

  • Substantial Logic Density: 6,656 logic elements and 832 LABs provide a compact platform for medium-complexity designs without moving to larger families.
  • Ample On-Chip RAM: 65,536 bits of embedded memory reduce dependence on external memory for buffering and megafunctions, simplifying BOM and board routing.
  • High Pin Count: 369 I/O pins enable multiple parallel buses and rich peripheral connectivity from a single device package.
  • Surface-Mount BGA Packaging: 484-ball 23×23 FBGA delivers high interconnect density and a smaller PCB footprint for space-constrained designs.
  • Mature Family-Level Features: JTAG boundary-scan, dedicated carry/cascade chains, and low-skew clock trees (documented for the FLEX 10K family) facilitate faster bring-up and reliable timing.
  • RoHS Compliance: Supports lead-free assembly processes and aligns with common environmental requirements.

Why Choose EPF10K130EFC484-3N?

The EPF10K130EFC484-3N provides a balanced combination of logic capacity, embedded RAM, and high I/O in a commercial-grade FLEX 10K device. Its architecture and family-level features support integration of megafunctions and complex custom logic while keeping board-level footprint compact thanks to the 484-ball BGA.

This device is well suited to design teams building consumer and embedded systems that require scalable programmable logic, considerable on-chip memory, and extensive I/O without moving to higher-cost, higher-power alternatives. The FLEX 10K family documentation and development support make it practical to integrate this device reliably into production designs.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EPF10K130EFC484-3N.

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