EPF10K130EFC672-1

The EPF10K130EFC672-1 is a FLEX-10KE series field programmable gate array from Intel, delivering a high-capacity embedded programmable logic device for system-level integration. The device combines substantial logic and memory resources with a large I/O count and a compact BGA package, enabling SOPC-style integration, custom logic, and interface bridging in commercial-temperature embedded designs.

Key Features

• Logic Capacity — 6,656 logic elements and 342,000 specified gates provide substantial programmable logic resources for medium-to-high density designs.
• Embedded Memory — 65,536 total RAM bits (≈64 Kbits) of on-chip memory for local buffering, FIFOs, and megafunction implementation.
• I/O Resources — 413 user I/O pins support extensive peripheral and interface connectivity from a single device footprint.
• Package & Mounting — 672-BBGA package (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for board-area-efficient deployment.
• Power & Temperature — Voltage supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 70 °C, with commercial grade designation.
• System Configuration — Series-level features include in-circuit reconfigurability via external configuration device or JTAG and built-in JTAG boundary-scan compliant with IEEE Std. 1149.1-1990.
• Interconnect & Arithmetic Support — FastTrack interconnect architecture and dedicated carry and cascade chains for efficient implementation of arithmetic functions and high-fan-in logic (series-level features).
• Clocking Options — Series-level ClockLock and ClockBoost options and built-in low-skew clock distribution (series-level features) support robust clocking strategies.
• Environmental — RoHS compliant.

Typical Applications

• Embedded Systems and SOPC Integration: Use the device to consolidate custom peripherals, glue logic, and local memory into a single programmable component for system-on-a-programmable-chip implementations.
• Interface Bridging and I/O Expansion: With 413 I/Os, the device is suitable for implementing protocol adapters, bus bridges, and parallel/serial interface aggregation.
• Custom Logic and Megafunctions: On-chip RAM and the series’ embedded-array approach allow implementation of FIFOs, specialized accelerators, and application-specific megafunctions.
• Prototyping and Evaluation Platforms: The package density and reconfigurability make it useful for hardware prototyping and iterative development of complex logic blocks.

Unique Advantages

• High integration in a single device: Combines thousands of logic elements, substantial on-chip RAM, and hundreds of I/Os to reduce external components and simplify board design.
• Flexible configuration options: Supports in-circuit reconfigurability and JTAG boundary-scan for field updates and board-level testability.
• Deterministic interconnect and arithmetic primitives: FastTrack routing and dedicated carry/cascade chains streamline implementation of adders, counters, and wide logic functions (series-level advantages).
• Space-efficient BGA package: 672-pin BGA (27×27) surface-mount package enables high-density placement and preserves board real estate.
• Commercial-grade reliability with RoHS compliance: Commercial operating range (0 °C to 70 °C) and RoHS conformity support mainstream embedded product lines and regulatory requirements.

Why Choose EPF10K130EFC672-1?

The EPF10K130EFC672-1 positions itself as a versatile, mid-to-high density programmable logic option within the FLEX-10KE family. Its combination of 6,656 logic elements, 65,536 bits of embedded memory, and 413 I/Os in a compact 672-pin BGA enables designers to consolidate logic, memory, and interfaces into a single device for streamlined board designs.

This part is suited for commercial embedded customers aiming for scalability and in-field configurability, benefiting from series-level system features such as JTAG boundary-scan, FastTrack interconnect, and dedicated arithmetic chains. The device’s package, electrical, and environmental specifications make it appropriate for a broad set of mainstream embedded and prototyping applications where reconfigurable integration and I/O density are priorities.

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