EPF10K130EFI484-2K

The EPF10K130EFI484-2K is a FLEX-10KE field-programmable gate array designed for system-on-a-programmable-chip (SOPC) integration. It combines a high-density logic array with embedded array blocks to implement memory and specialized logic functions on a single surface-mount device.

With 6,656 logic elements, approximately 65,536 bits of embedded RAM, and 369 user I/O pins in a 484-BBGA package, this industrial-grade device targets embedded designs requiring integration, reconfigurability and robust operating range (–40 °C to 85 °C).

Key Features

• Core Capacity 6,656 logic elements and a maximum system gate count of 342,000 provide substantial programmable logic for complex designs.
• Embedded Memory (EABs) Approximately 65,536 bits of on-chip RAM with dedicated embedded array blocks (EABs) and dual-port capability supporting up to 16-bit width per EAB for efficient buffering and megafunctions.
• I/O Density & Flexibility 369 user I/O pins support multi-voltage interfacing; Fast I/O performance and programmable pin options enable a range of board-level interfaces.
• Voltage & Power Internal supply range 2.375 V to 2.625 V (operates with a 2.5-V internal supply); architecture includes low-power design characteristics.
• Configuration & Test In-circuit reconfigurability (ICR) via external configuration devices or JTAG; built-in IEEE 1149.1 boundary-scan support for board-level test without consuming device logic.
• Package & Thermal 484-BBGA (supplier package: 484-FBGA, 23×23) surface-mount package rated for industrial temperature range (–40 °C to 85 °C).
• System Features Series-level features include FastTrack interconnect, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and options for low-skew clock distribution and clock multiplication.

Typical Applications

• System-on-a-Chip Integration Implement SOPC designs and megafunctions where embedded memory and reconfigurable logic consolidate functions onto a single device.
• High‑Density Logic and Buffering Use the on-chip RAM and dual-port EABs for data buffering, packet processing, or memory-intensive logic paths.
• Board-Level I/O and Bus Interfaces Leverage abundant I/O and multi‑voltage support for interfacing with diverse peripheral voltages and bus standards.
• Industrial Control Industrial-grade temperature and package options make the device suitable for automation and control applications requiring reconfigurable logic.

Unique Advantages

• High logic integration: 6,656 logic elements and a large gate budget allow consolidation of multiple system functions into one FPGA, reducing external component count.
• On-chip dual-port memory: Approximately 65,536 bits of embedded RAM with dual-port EABs support parallel access patterns and efficient megafunction implementation.
• Flexible I/O and voltage support: 369 user I/O pins with multi-voltage capability provide flexible interfacing to a broad set of peripherals and buses.
• Built-in test and reconfiguration: JTAG boundary-scan and in-circuit reconfigurability simplify board test, development iterations, and field updates without consuming user logic.
• Industrial-rated package and temperature: Surface-mount 484-BBGA packaging and –40 °C to 85 °C operating range support demanding environment deployment.

Why Choose EPF10K130EFI484-2K?

The EPF10K130EFI484-2K positions itself as a versatile, industrial-grade FPGA option for designers who need moderate-to-high logic density combined with embedded RAM and flexible I/O in a compact BGA package. Its combination of reconfigurability, on-chip memory, and built-in test features makes it suitable for embedded systems, industrial control, and board-level interface applications where integration and field programmability reduce BOM and enable design iteration.

Backed by the FLEX-10KE family architecture, the device delivers predictable routing and dedicated hardware structures (carry and cascade chains) that streamline implementation of arithmetic and high-fan-in logic, while multi-configuration and JTAG support aid development and manufacturing flow.

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