EPF10K130EFC672-2X

The EPF10K130EFC672-2X is a FLEX-10KE® field programmable gate array from Altera, provided in a high-density 672-ball BGA package. It delivers 6,656 logic elements, 65,536 bits of on-chip RAM, and a large I/O count for commercial embedded designs requiring reconfigurable logic and significant interface capacity.

Designed for surface-mount application, this commercial-grade FPGA operates from a 2.375 V to 2.625 V supply and across a 0 °C to 70 °C ambient range, making it suitable for a range of standard commercial electronic systems.

Key Features

• Core Logic  6,656 logic elements enabling complex custom logic implementation and programmable datapaths.
• Embedded Memory  Approximately 0.066 Mbits (65,536 bits) of on-chip RAM to support buffering, FIFOs, and small local memory structures.
• I/O Capacity  413 available I/O pins to support multiple parallel interfaces and high connector densities.
• Gate Equivalent  342,000 gates providing a measure of the device’s overall logic capacity for medium-complexity designs.
• Package  672-BBGA package (supplier device package: 672-FBGA, 27 × 27 mm) for high pin-count, dense board layouts.
• Power and Operating Range  Narrow core supply range of 2.375 V to 2.625 V and commercial operating temperature of 0 °C to 70 °C.
• Mounting and Compliance  Surface-mount BGA design with RoHS compliance for lead-free assembly processes.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and peripheral interfacing in compact, surface-mount modules.
• High-Density I/O Designs  Support complex board-level I/O requirements such as parallel data buses and multi-channel interfaces.
• Prototyping and Development  Use the reprogrammable logic and on-chip RAM for iterative hardware development and functional validation.

Unique Advantages

• Significant Logic Capacity: 6,656 logic elements provide a substantial resource pool for implementing custom digital functions without external ASICs.
• High I/O Count: 413 I/O pins allow direct connection to numerous peripherals and parallel interfaces, reducing external buffering needs.
• On-Chip Memory: 65,536 bits of embedded RAM enable localized data storage for buffering and state retention within the FPGA fabric.
• Compact, High-Density Package: 672-ball BGA (672-FBGA, 27 × 27 mm) offers a high pin count in a compact footprint suitable for dense PCB layouts.
• Commercial-Grade Availability: Designed for commercial-temperature operation (0 °C to 70 °C) and RoHS-compliant manufacturing.
• Defined Power Envelope: A specific supply range (2.375 V–2.625 V) that supports consistent power management planning during system design.

Why Choose EPF10K130EFC672-2X?

The EPF10K130EFC672-2X positions itself as a versatile, mid-range FLEX-10KE FPGA for commercial embedded designs that require moderate logic density, sizeable I/O capability, and on-chip memory. Its combination of 6,656 logic elements, approximately 65,536 bits of RAM, and 413 I/Os makes it suitable for designers balancing integration, board-level connectivity, and reprogrammability.

Engineers and procurement teams will find value in its high-density 672-BBGA package and RoHS compliance, enabling compact, lead-free assemblies for a broad set of commercial applications where reconfigurable logic and interface density are primary requirements.

Request a quote or submit an inquiry to receive pricing and availability for EPF10K130EFC672-2X and to discuss how this FPGA can fit your next commercial design.