EPF10K130EFC484-3

The EPF10K130EFC484-3 is a FLEX 10K family FPGA from Intel designed as an embedded programmable logic device for system-level integration. It combines a high-density logic array with embedded memory and flexible I/O capabilities to support custom digital logic, glue logic, and on-board peripheral integration.

This commercial-grade, surface-mount device provides 6,656 logic elements, approximately 0.065 Mbits of embedded RAM, and 369 user I/O pins in a 484-BBGA (23×23) package, with a supply range of 2.375–2.625 V and an operating temperature range of 0 °C to 70 °C.

Key Features

• Logic Capacity — 6,656 logic elements and 832 LABs provide a high-density programmable fabric for complex combinational and sequential logic.
• Embedded Memory — 65,536 total RAM bits (approximately 0.065 Mbits) for on-chip storage and buffering without reducing logic capacity.
• I/O and Connectivity — 369 user I/O pins support diverse external interfaces and board-level integration.
• Gates — 342,000 gates available to implement system logic and embedded functions.
• Power and Supply — Operates from 2.375 V to 2.625 V, enabling integration into systems using that voltage domain.
• Package and Mounting — 484-BBGA (supplier package listed as 484-FBGA, 23×23) for compact, surface-mount board designs.
• Commercial Temperature Range — Rated for 0 °C to 70 °C operation for standard commercial applications.
• Standards and Test — RoHS compliant; series datasheet documents built-in JTAG boundary-scan (IEEE Std. 1149.1) and family features such as embedded arrays and system-level integration options.

Typical Applications

• System Integration and SOPC — Use the device to implement system-on-a-programmable-chip (SOPC) functions and integrate custom peripherals with on-chip logic and memory.
• Protocol Bridging and Glue Logic — Implement protocol conversion and timing adaptation between subsystems using the device’s abundant I/O and logic resources.
• Prototyping and Development — Leverage the reprogrammable fabric and JTAG support for iterative hardware development and validation.
• Embedded Control and Sequencing — Deploy on-board control state machines, interfaces, and buffering where compact, programmable logic is required.

Unique Advantages

• High-density programmable fabric: 6,656 logic elements and 832 LABs allow substantial logic integration in a single device, reducing board-level component count.
• On-chip RAM for megafunctions: 65,536 bits of embedded memory enable local buffering and table storage without external SRAM.\
• Large user I/O count: 369 user I/O pins support complex peripheral interfaces and parallel buses directly from the FPGA.
• Compact packaging: 484-BBGA (23×23) provides a space-efficient surface-mount footprint for dense PCB layouts.
• Verified family features: Series-level features such as JTAG boundary-scan, dedicated carry/cascade chains, and embedded array support provide design flexibility documented in the FLEX 10K family datasheet.

Why Choose EPF10K130EFC484-3?

The EPF10K130EFC484-3 positions itself as a versatile, commercial-grade FPGA for designs that require substantial on-chip logic, embedded memory, and a high pin count in a compact BGA package. Its supply and temperature ratings make it suitable for standard commercial applications where reprogrammable logic and system integration are priorities.

Designers and engineers seeking to consolidate board-level functions, accelerate prototyping, or implement custom peripheral logic will find the combination of logic elements, embedded RAM, and I/O count advantageous. The device benefits from documented FLEX 10K family capabilities that support common FPGA development flows and system-level features.

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