EPF10K130EFC484-2X

The EPF10K130EFC484-2X is a FLEX-10KE family field-programmable gate array in a 484-ball BGA package optimized for commercial applications. It integrates a high-density logic array and embedded memory to support system-on-a-programmable-chip integration, enabling implementation of megafunctions, memory blocks, and general-purpose logic in a single device.

With 6,656 logic elements, 65,536 bits of on-chip RAM, and 369 I/O pins, this device targets embedded and system-level designs that require moderate to high logic capacity, flexible I/O, and board-space-efficient packaging within a 0 °C to 70 °C operating range.

Key Features

• Logic Capacity — 6,656 logic elements and approximately 342,000 gates provide substantial programmable logic density for glue logic, state machines, and control functions.
• Embedded Memory — 65,536 total RAM bits of on-chip memory for implementing buffers, small FIFOs, and other megafunctions without external SRAM.
• I/O and System Connectivity — 369 user I/O pins support broad peripheral interfacing and system interconnect requirements.
• Package and Mounting — 484-ball FBGA (23×23) in a surface-mount package delivers compact board footprint for space-constrained designs.
• Power — Device supply voltage range specified at 2.375 V to 2.625 V to match system power requirements.
• Commercial Temperature Grade — Rated for operation from 0 °C to 70 °C for commercial electronics deployments.
• Configuration and Test Support — Series features such as in-circuit reconfigurability and IEEE Std. 1149.1 JTAG boundary-scan support enable flexible programming and board-level test without consuming user logic.
• Clocking and Interconnect — Family-level features include low-skew clock distribution, dedicated carry and cascade chains, and fast, predictable interconnect for high-performance arithmetic and wide logic functions.
• Compliance — RoHS compliant.

Typical Applications

• System Integration — Implement SOPC-style integration of custom logic, memory blocks, and peripheral glue to consolidate functionality on a single device.
• Memory and Buffering — Use embedded RAM to implement on-chip FIFOs, small frame buffers, and storage for data-handling functions.
• High‑I/O Interface Control — Leverage 369 I/Os for complex board-level interfaces, protocol bridging, and peripheral expansion.
• Prototyping and Development — Suitable for evaluating logic partitioning and validating embedded functions before production implementation.

Unique Advantages

• Substantial On‑Chip Logic — 6,656 logic elements reduce reliance on external CPLDs or discrete logic, lowering system complexity.
• Embedded Memory Size — 65,536 bits of RAM enable internal buffering and megafunction implementation without adding external memory components.
• High I/O Count — 369 I/Os provide flexibility for multi‑bus and multi‑peripheral designs, simplifying board routing and integration.
• BGA Packaging for Density — 484-ball FBGA (23×23) balances pin count and board-area efficiency for compact designs.
• Commercial Temperature and RoHS Compliance — Designed for commercial temperature environments and compliant with RoHS requirements for regulatory adherence.

Why Choose EPF10K130EFC484-2X?

The EPF10K130EFC484-2X positions itself as a capable FLEX-10KE series FPGA for commercial embedded and system applications that need a combination of logic density, embedded memory, and extensive I/O in a compact BGA package. Its architecture supports on-chip megafunctions and flexible interconnect while providing configuration and test features to streamline development and manufacturing.

This device is well suited for designers building system-level logic, memory controllers, interface bridges, and mid-density programmable solutions where board space, I/O flexibility, and embedded memory are key considerations. The FLEX-10KE family features and the device’s specification set offer a pathway for scalable designs and continued development within the same family.

Request a quote or submit an inquiry to get pricing, availability, and integration support for the EPF10K130EFC484-2X.