EPF10K130EFC484-1

The EPF10K130EFC484-1 is a FLEX-10KE family FPGA IC designed for embedded programmable logic and system-level integration. It combines a high-density logic array with on-chip memory and a large I/O count to support complex digital functions and megafunction implementation in commercial-temperature applications.

Targeted uses include embedded systems and board-level designs that require reconfigurable logic, on-chip RAM, and flexible I/O in a compact ball-grid-array package.

Key Features

• Core Logic — 6,656 logic elements and 832 LABs providing a dense fabric for implementing custom logic and state machines; device data lists a total of 342,000 gates.
• Embedded Memory — 65,536 bits of total on-chip RAM to support FIFOs, small buffers, and megafunction storage without using external memory.
• I/O Capacity — 369 user I/O pins suitable for wide parallel interfaces, multiple peripherals, and board-level signal routing.
• Supply and Operating Range — Core supply specified at 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
• Package and Mounting — Surface-mount 484-BBGA package (supplier package 484-FBGA, 23 × 23) for high-density board layouts and compact footprints.
• Family-Level System Features — FLEX 10K family features include embedded arrays for megafunctions, in-circuit reconfigurability options, JTAG boundary-scan support, low-skew clock distribution, and dedicated carry and cascade chains for arithmetic and high-fan-in logic (series-level capabilities from the FLEX 10K family).
• Compliance — RoHS compliant, supporting environmental regulation requirements for lead-free assemblies.

Typical Applications

• Embedded System Controllers — Use the FPGA’s logic resources and on-chip RAM to implement control state machines, peripheral interfaces, and custom glue logic.
• High-Density I/O Bridging — 369 I/O pins enable wide parallel buses, protocol translation, and multi-channel sensor or data acquisitions.
• Custom ASIC Prototyping — Dense logic and reconfigurability allow hardware validation and iterative development before full ASIC commitment.
• Board-Level Integration — The 484-BBGA package and surface-mount mounting support compact, space-efficient designs that consolidate discrete functions into a single programmable device.

Unique Advantages

• High Logic and Gate Count: 6,656 logic elements and 342,000 gates provide the capacity to implement complex digital systems without multiple discrete devices.
• Integrated On-Chip Memory: 65,536 bits of embedded RAM reduce dependence on external memory for buffering and control logic, simplifying BOM and layout.
• Large, Flexible I/O: 369 user I/Os accommodate diverse peripheral connections and parallel interfaces, enabling flexible system partitioning.
• Compact Ball-Grid Package: 484-BBGA (23 × 23) minimizes PCB area while providing a high pin count for dense designs.
• Series-Level Programmability and Test: FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfigurability support manufacturing test and field updates without consuming device logic.
• Regulatory Compliance: RoHS-compliant construction supports lead-free assembly and environmental requirements.

Why Choose EPF10K130EFC484-1?

The EPF10K130EFC484-1 positions itself as a commercially graded FPGA delivering a balance of logic density, embedded RAM, and extensive I/O in a compact BGA footprint. Its family-level features for reconfigurability, boundary-scan, and dedicated arithmetic chains make it suitable for designs that need on-board programmability, rapid iteration, and medium-complexity integration.

This device is well suited to developers and procurement teams building embedded controllers, board-level consolidations, and prototype hardware requiring deterministic operating-temperature and supply ranges backed by FLEX 10K family capabilities.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the EPF10K130EFC484-1.