EPF10K130EFC484-1X

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA

Quantity 1,357 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells6656
Number of Gates342000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of EPF10K130EFC484-1X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA

The EPF10K130EFC484-1X is a FLEX 10K family FPGA offering embedded programmable logic and on-chip memory for system-level integration. It combines a logic array and embedded array blocks to implement megafunctions such as efficient memory and specialized logic functions.

Designed for commercial applications, this device provides a balance of logic capacity, embedded RAM, and high I/O count to support reconfigurable designs that require in-circuit reconfigurability, built-in boundary-scan, and flexible I/O control.

Key Features

  • Logic Capacity  Approximately 6,656 logic elements and 832 logic array blocks, enabling medium-density programmable logic implementations.
  • Embedded Memory  65,536 bits of on-chip RAM suitable for implementing buffers, small memories, and megafunctions.
  • I/O Density  369 user I/O pins to support extensive peripheral and bus interfacing.
  • Gate Count  342,000 device gates indicated for system-capacity planning.
  • Packaging  484-BBGA surface-mount package (supplier device package: 484-FBGA, 23×23) for compact board integration.
  • Power  Operates from a core supply range of 2.375 V to 2.625 V.
  • Operating Range  Commercial grade device rated for 0 °C to 70 °C.
  • System-Level Family Features  FLEX 10K family attributes include embedded arrays for megafunctions, in-circuit reconfigurability via external configuration devices or JTAG, built-in JTAG boundary-scan test (IEEE 1149.1), and flexible interconnect structures.
  • I/O Control and Performance Options  Family-level options include programmable output slew-rate control, individual tri-state output enable, open-drain options, and clock distribution features such as multiple global clocks and dedicated carry/cascade chains.
  • Compliance  RoHS compliant.

Typical Applications

  • System Integration  Implement System-on-a-Programmable-Chip (SOPC) style functions by combining embedded memory and logic to consolidate glue logic and peripheral functions on a single device.
  • Embedded Memory Functions  Use the on-chip RAM blocks for buffers, small data stores, and other megafunction implementations that benefit from fast local memory.
  • Bus and Peripheral Interfaces  High I/O count supports interfacing to multiple buses and peripherals; FLEX 10K family devices include features that support common bus integrations at the system level.
  • Programmable Logic and Control  Ideal for custom control logic, state machines, and application-specific processing where reconfigurability and moderate logic density are required.

Unique Advantages

  • Generous Logic Capacity:  About 6,656 logic elements provide substantial resources for medium-complexity designs without moving to larger form factors.
  • Integrated On-Chip Memory:  65,536 bits of embedded RAM reduce external memory needs for many control and buffering tasks, simplifying BOM and board routing.
  • High I/O Count:  369 user I/O pins allow dense peripheral and bus connectivity directly to the FPGA.
  • Compact BGA Packaging:  484-ball BGA footprint (23×23) enables a high-pin-count solution in a compact area for space-constrained PCBs.
  • Design and Test Support:  Built-in JTAG boundary-scan and family-level reconfigurability simplify development, testing, and in-system updates.
  • Regulatory and Assembly Friendly:  RoHS compliance and surface-mount packaging support modern PCB assembly and environmental requirements.

Why Choose EPF10K130EFC484-1X?

The EPF10K130EFC484-1X positions itself as a commercially graded, medium-density FLEX 10K FPGA that blends on-chip RAM, a robust logic array, and high I/O capacity in a compact BGA package. It is well suited for designs that need embedded memory and reconfigurable logic with the ability to perform system-level integration without excessive external components.

Customers building embedded controllers, peripheral interfaces, or system glue logic will find the device offers a practical balance of capacity, I/O, and package density, combined with family-level features such as JTAG testability and in-circuit reconfigurability for streamlined development and maintenance.

Request a quote or submit a procurement inquiry to check availability and get pricing for the EPF10K130EFC484-1X. Our team can provide lead-time and ordering guidance tailored to your project requirements.

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