EPF10K130EFC484-1X
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA |
|---|---|
| Quantity | 1,357 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 369 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 6656 | ||
| Number of Gates | 342000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of EPF10K130EFC484-1X – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 369 65536 6656 484-BBGA
The EPF10K130EFC484-1X is a FLEX 10K family FPGA offering embedded programmable logic and on-chip memory for system-level integration. It combines a logic array and embedded array blocks to implement megafunctions such as efficient memory and specialized logic functions.
Designed for commercial applications, this device provides a balance of logic capacity, embedded RAM, and high I/O count to support reconfigurable designs that require in-circuit reconfigurability, built-in boundary-scan, and flexible I/O control.
Key Features
- Logic Capacity Approximately 6,656 logic elements and 832 logic array blocks, enabling medium-density programmable logic implementations.
- Embedded Memory 65,536 bits of on-chip RAM suitable for implementing buffers, small memories, and megafunctions.
- I/O Density 369 user I/O pins to support extensive peripheral and bus interfacing.
- Gate Count 342,000 device gates indicated for system-capacity planning.
- Packaging 484-BBGA surface-mount package (supplier device package: 484-FBGA, 23×23) for compact board integration.
- Power Operates from a core supply range of 2.375 V to 2.625 V.
- Operating Range Commercial grade device rated for 0 °C to 70 °C.
- System-Level Family Features FLEX 10K family attributes include embedded arrays for megafunctions, in-circuit reconfigurability via external configuration devices or JTAG, built-in JTAG boundary-scan test (IEEE 1149.1), and flexible interconnect structures.
- I/O Control and Performance Options Family-level options include programmable output slew-rate control, individual tri-state output enable, open-drain options, and clock distribution features such as multiple global clocks and dedicated carry/cascade chains.
- Compliance RoHS compliant.
Typical Applications
- System Integration Implement System-on-a-Programmable-Chip (SOPC) style functions by combining embedded memory and logic to consolidate glue logic and peripheral functions on a single device.
- Embedded Memory Functions Use the on-chip RAM blocks for buffers, small data stores, and other megafunction implementations that benefit from fast local memory.
- Bus and Peripheral Interfaces High I/O count supports interfacing to multiple buses and peripherals; FLEX 10K family devices include features that support common bus integrations at the system level.
- Programmable Logic and Control Ideal for custom control logic, state machines, and application-specific processing where reconfigurability and moderate logic density are required.
Unique Advantages
- Generous Logic Capacity: About 6,656 logic elements provide substantial resources for medium-complexity designs without moving to larger form factors.
- Integrated On-Chip Memory: 65,536 bits of embedded RAM reduce external memory needs for many control and buffering tasks, simplifying BOM and board routing.
- High I/O Count: 369 user I/O pins allow dense peripheral and bus connectivity directly to the FPGA.
- Compact BGA Packaging: 484-ball BGA footprint (23×23) enables a high-pin-count solution in a compact area for space-constrained PCBs.
- Design and Test Support: Built-in JTAG boundary-scan and family-level reconfigurability simplify development, testing, and in-system updates.
- Regulatory and Assembly Friendly: RoHS compliance and surface-mount packaging support modern PCB assembly and environmental requirements.
Why Choose EPF10K130EFC484-1X?
The EPF10K130EFC484-1X positions itself as a commercially graded, medium-density FLEX 10K FPGA that blends on-chip RAM, a robust logic array, and high I/O capacity in a compact BGA package. It is well suited for designs that need embedded memory and reconfigurable logic with the ability to perform system-level integration without excessive external components.
Customers building embedded controllers, peripheral interfaces, or system glue logic will find the device offers a practical balance of capacity, I/O, and package density, combined with family-level features such as JTAG testability and in-circuit reconfigurability for streamlined development and maintenance.
Request a quote or submit a procurement inquiry to check availability and get pricing for the EPF10K130EFC484-1X. Our team can provide lead-time and ordering guidance tailored to your project requirements.

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