EPF10K130EFC484-2

The EPF10K130EFC484-2 is a FLEX 10K family field programmable gate array providing embedded programmable logic for system-level integration. Built for applications that require a balance of logic density, on-chip memory and flexible I/O, this surface-mount FPGA is supplied in a 484‑BBGA package and designed for commercial-temperature systems.

With 6,656 logic elements, approximately 64 Kbits of embedded RAM, and 369 user I/Os, the device targets designs that combine custom logic, memory megafunctions and peripheral interfacing within a single programmable device.

Key Features

• Logic Capacity — 6,656 logic elements supporting up to 342,000 gates for implementing medium-complexity custom logic and glue functions.
• Embedded Memory — Total RAM bits: 65,536 (approximately 64 Kbits) for on-chip buffering, FIFOs or small data structures without external memory.
• I/O Resources — 369 user I/O pins offering extensive external connectivity and flexible pin control (family datasheet documents programmable I/O features such as individual tri-state, open-drain, and slew-rate control).
• Package & Mounting — 484‑BBGA package (supplier package: 484‑FBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Power — Voltage supply range: 2.375 V to 2.625 V, enabling designs that require this specific core/IO supply window.
• Operating Conditions — Commercial grade device rated for 0 °C to 70 °C operation.
• On-board Test & Configuration — Family-level features include built-in JTAG boundary-scan for in-circuit test and configuration options via external configuration devices or JTAG.
• System-Level Architecture — FLEX 10K family capabilities such as embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and clock distribution options (ClockLock/ClockBoost) to support predictable timing and common arithmetic/logic primitives.
• Compliance — RoHS compliant.

Typical Applications

• System Integration / SOPC — Implement custom system glue logic, peripheral interfaces and on-chip megafunctions where a mix of logic and embedded memory simplifies board-level design.
• Protocol and Interface Bridging — Use the device’s 369 I/Os and programmable logic to implement protocol translators, bus bridges or peripheral controllers.
• Memory Buffers and Data Paths — Leverage the approximately 64 Kbits of embedded RAM for small FIFOs, buffering and temporary storage in data-path applications.
• Prototyping and Embedded Development — Provides medium-density logic and on-chip resources for evaluating custom logic partitions and early system prototypes at commercial temperatures.

Unique Advantages

• Balanced Logic and Memory: 6,656 logic elements combined with 65,536 RAM bits provide a practical balance for designs that mix control logic and embedded data storage.
• Extensive I/O Count: 369 user I/Os enable rich external connectivity for peripherals, sensors and bus interfaces without immediate need for expansion devices.
• Compact BGA Packaging: 484‑BBGA (23×23) package delivers a high pin-count footprint in a compact surface-mount form factor suitable for dense PCBs.
• Family-Level Design Support: FLEX 10K family features such as FastTrack interconnect, dedicated carry/cascade chains and JTAG support streamline implementation of arithmetic, high-fan-in logic and in-circuit test/configuration.
• Commercial-Grade Reliability: Commercial operating range (0 °C to 70 °C) and RoHS compliance align with standard industrial and consumer product requirements.

Why Choose EPF10K130EFC484-2?

The EPF10K130EFC484-2 positions itself as a flexible mid-density FPGA solution for designers who need a blend of logic resources, embedded RAM and substantial I/O within a compact BGA package. Its feature set supports implementation of system-in-a-chip style functions—combining custom logic, memory megafunctions and peripheral interfacing—while offering family-level capabilities for predictable timing and in-circuit configuration.

This device is well suited to embedded engineers and OEMs developing commercial-temperature applications that require moderate gate counts, on-chip buffering and high I/O availability, backed by the FLEX 10K family design features and configuration/test support documented in the product datasheet.

Request a quote or submit a purchase inquiry to obtain pricing, lead times and availability for the EPF10K130EFC484-2.