EPF10K130EBC600-2

The EPF10K130EBC600-2 is an Altera FLEX-10KE family field programmable gate array supplied in a 600-ball BGA surface-mount package. It combines 6,656 logic elements, approximately 0.065 Mbits of embedded RAM (65,536 bits), and 424 user I/O pins to support mid-range programmable logic applications.

Engineered for commercial-grade deployments, the device operates from a 2.375 V to 2.625 V supply and is specified for an operating temperature range of 0 °C to 70 °C. The 45 × 45 mm 600-BGA package enables dense routing and compact board-level integration.

Key Features

• Core / Logic  The FLEX-10KE FPGA architecture provides 6,656 logic elements suitable for combinational and sequential logic implementation.
• Embedded Memory  Approximately 0.065 Mbits (65,536 bits) of on-chip RAM for data buffering, small FIFOs, and localized storage.
• I/O Capacity  424 user I/O pins to support multiple parallel interfaces and high-pin-count connectivity requirements.
• Package  600-ball BGA surface-mount package (45 × 45 mm) for compact PCB footprint and dense routing.
• Power  Core supply range of 2.375 V to 2.625 V for device operation.
• Temperature & Grade  Commercial grade with an operating range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant for lead-free design considerations.

Typical Applications

• FPGA-based prototyping  Implement and validate logic designs that require 6,656 logic elements and extensive I/O connectivity.
• High-density I/O interfaces  Leverage 424 I/O pins to interface multiple peripherals, parallel buses, or multi-channel signals without external expanders.
• Embedded control and glue logic  Use the device for system glue, protocol bridging, and control tasks where moderate embedded RAM and flexible logic resources are needed.

Unique Advantages

• High logic capacity: 6,656 logic elements provide substantial resources for mid-range FPGA designs.
• Extensive I/O: 424 user I/O pins reduce the need for additional interface components.
• On-chip RAM: Approximately 0.065 Mbits of embedded memory supports buffering and small data storage requirements.
• Compact BGA packaging: 600-BGA (45 × 45 mm) enables a small board footprint with dense routing capabilities.
• Commercial temperature rating: Rated for 0 °C to 70 °C to match standard commercial applications.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing environments.

Why Choose EPF10K130EBC600-2?

The EPF10K130EBC600-2 delivers a balance of logic resources, embedded RAM, and a high I/O count in a compact 600-BGA surface-mount package, making it a practical choice for commercial FPGA designs that require substantial connectivity in a small footprint. With a defined supply voltage range of 2.375 V to 2.625 V and a 0 °C to 70 °C operating window, it is suited to standard embedded and prototyping applications where those electrical and thermal parameters are appropriate.

As an Altera FLEX-10KE device, it provides a predictable set of on-chip resources for designers and procurement teams evaluating mid-range programmable logic solutions.

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