EPF10K130EBC356-2

The EPF10K130EBC356-2 is a FLEX-10KE® field programmable gate array (FPGA) from Altera supplied in a 356-LBGA package. It provides a balance of programmable logic resources, on-chip memory, and high I/O count targeted at commercial electronic designs that require configurable digital logic.

Key Features

• Programmable Logic 6,656 logic elements enable implementation of custom digital functions and moderate-complexity logic designs.
• Embedded Memory 65,536 bits of on-chip RAM (65.5k bits) for data buffering, state storage, and small lookup tables.
• I/O Density 274 user I/O pins support multiple external interfaces and parallel connections to peripherals and subsystems.
• Package and Mounting 356-LBGA (356-BGA, 35×35) ball grid array package optimized for surface-mount assembly.
• Power Core/primary supply voltage range of 2.375 V to 2.625 V to match target system power rails.
• Commercial Temperature Grade Rated for 0 °C to 70 °C operation for commercial temperature environments.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Commercial Embedded Systems — Implement custom control and logic functions in commercial electronic products operating within 0 °C to 70 °C.
• Prototyping and Development — Use the FPGA’s programmable resources and abundant I/O for evaluating digital architectures and validating interfaces.
• Interface and Glue Logic — Leverage 274 I/O pins to consolidate multiple peripheral interfaces and perform protocol bridging.

Unique Advantages

• Balanced Logic Capacity: 6,656 logic elements offer sufficient resources for moderate-complexity designs without excessive overhead.
• On-Chip Memory Availability: 65,536 bits of embedded RAM provide local storage for buffering and state retention, reducing external memory needs for some designs.
• High I/O Count: 274 I/O pins allow direct connections to a variety of peripherals, sensors, and buses, simplifying board design.
• Compact BGA Package: The 356-LBGA (35×35) package delivers high pin density in a surface-mount form factor suitable for space-constrained boards.
• Commercial Grade Certification: Specified operating range of 0 °C to 70 °C aligns with typical commercial product requirements.
• RoHS Compliance: Supports lead-free manufacturing and regulatory compliance for global supply chains.

Why Choose EPF10K130EBC356-2?

The EPF10K130EBC356-2 offers a practical combination of logic resources, embedded memory, and extensive I/O in a compact 356-LBGA package. Its voltage supply range and commercial temperature rating make it suitable for a wide range of commercial electronic designs that require configurable digital logic and substantial peripheral connectivity.

This FPGA is well suited to teams and OEMs looking for a scalable, programmable building block to implement glue logic, interface consolidation, or moderate-complexity digital subsystems while maintaining RoHS compliance and surface-mount assembly compatibility.

Request a quote or submit an inquiry to our sales team for pricing, lead times, and availability for the EPF10K130EBC356-2.