EPF10K130EFC672-1X

The EPF10K130EFC672-1X is a FLEX-10KE family field programmable gate array (FPGA) in a 672-ball BGA package. It combines a dense logic array and embedded memory to support system-level integration and custom digital functions for commercial applications.

Built for designers who need a high-pin-count, reconfigurable device, this part offers significant on-chip logic and RAM with flexible I/O and a compact surface-mount package suitable for space-constrained boards.

Key Features

• Logic Capacity  Approximately 6,656 logic elements with a device gate count listed as 342,000, enabling substantial custom digital implementation.
• Embedded Memory  65,536 total RAM bits of on-chip memory, suitable for buffering, small data structures, and local storage for custom logic.
• I/O Density  413 available I/O pins to support wide peripheral interfacing and high-pin-count systems.
• Package & Mounting  672-ball BGA (27 × 27) package in a surface-mount form factor for board-level space efficiency and high-density routing.
• Supply & Temperature  Core supply range of 2.375 V to 2.625 V with an operating temperature range of 0 °C to 70 °C (commercial grade), matching commercial embedded and industrial-adjacent applications.
• System-Level Features (family)  FLEX-10K family features include embedded arrays for megafunctions, in-circuit reconfigurability, low-skew clock distribution, and configurable I/O options used to implement complex system functions.
• Standards & Compliance  RoHS compliant, supporting environmental compliance requirements for lead-free assemblies.

Typical Applications

• System Integration  Ideal for SOPC-style integration where embedded logic and memory implement custom glue logic, bus interfaces, or specialized processing blocks.
• Peripheral & Interface Control  High I/O count enables aggregation of multiple peripheral interfaces, protocol bridging, and custom I/O handling on a single device.
• Prototyping & Development  Well-suited for design iteration and prototype platforms that require reconfigurable logic and embedded memory.
• Custom Logic Acceleration  Use the device to offload deterministic, timing-critical functions from a host processor using dedicated on-chip resources.

Unique Advantages

• High integration density: Combines thousands of logic elements and tens of kilobits of embedded RAM to reduce external component count and simplify board design.
• Extensive I/O capability: 413 I/O pins provide flexibility for complex interfacing without multiple external translators or expanders.
• Compact BGA package: The 672-ball BGA (27 × 27) delivers high pin count in a compact footprint for dense PCBs and modern form factors.
• Family-level system features: FLEX-10K family capabilities such as in-circuit reconfigurability, low-skew clock routing, and dedicated arithmetic chains enable efficient implementation of common digital building blocks.
• Commercial-grade suitability: Rated for 0 °C to 70 °C operation, matching a wide range of commercial embedded applications.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for environmentally-conscious designs.

Why Choose EPF10K130EFC672-1X?

The EPF10K130EFC672-1X offers a balance of substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package, positioning it for commercial designs that require board-level integration and reconfigurable digital functions. Its FLEX-10K family features support system-level customization, reconfiguration, and common megafunction implementations.

This device is suited to developers and procurement teams building mid- to high-complexity digital systems who need a commercially graded FPGA with on-chip memory and extensive I/O for reducing BOM and consolidating discrete logic functions.

Request a quote or submit a product inquiry today to evaluate how the EPF10K130EFC672-1X can fit into your next design.