EPF10K130EFI484-2

The EPF10K130EFI484-2 is a FLEX-10KE family field programmable gate array (FPGA) in a 484-ball BGA package designed for embedded and industrial applications. It combines 6,656 logic elements, 65,536 bits of on-chip RAM, and 369 user I/Os to support complex glue logic, custom peripherals, and system integration tasks.

With an industrial operating temperature range and compact FBGA mounting, this device targets designs that require high I/O density, on-chip memory, and reconfigurable logic in a space-efficient package.

Key Features

• Core Logic  6,656 logic elements provide the programmable fabric for implementing custom logic, state machines, and control functions.
• Embedded Memory  65,536 bits of on-chip RAM support buffering, lookup tables, and small data structures without external memory.
• I/O Capacity  369 user I/O pins accommodate high-pin-count interfaces, board-level control, and multiple parallel buses.
• Package & Mounting  484-BBGA (supplier package: 484-FBGA, 23×23) surface-mount package maximizes board density while providing large pin counts for complex designs.
• Power Supply  Specified supply range of 2.375 V to 2.625 V for the device core or I/O domain as provided in the product data.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C to meet a wide range of environmental requirements.
• System and Test Support (Series Features)  Series-level capabilities include in-circuit reconfigurability, IEEE-1149.1 JTAG boundary-scan, and architectural features for implementing embedded megafunctions and efficient routing.

Typical Applications

• Industrial Control  Implement motor control logic, machine interfacing, and deterministic control functions using reconfigurable logic and abundant I/Os.
• Embedded System Integration  Integrate custom peripherals, protocol bridging, and board-level control functions while leveraging on-chip RAM for buffering and state.
• Communications & Networking  Handle protocol glue logic, parallel data buses, and custom interface logic that benefit from many I/O pins and programmable resources.
• Prototyping & Custom Accelerators  Rapidly iterate hardware-accelerated functions and prototype system-on-a-programmable-chip designs using the FLEX 10K family feature set.

Unique Advantages

• High I/O Density: 369 user I/Os enable multiple parallel interfaces and flexible board-level connectivity without external multiplexing.
• On-chip RAM for Low-Latency Tasks: 65,536 bits of embedded memory let you implement FIFOs, buffers, and small data stores without adding external memory.
• Industrial Operating Range: −40 °C to 85 °C rating supports deployment in demanding temperature environments.
• Space-efficient BGA Packaging: 484-ball FBGA footprint offers a compact solution for high-pin-count designs, saving PCB area while keeping routing options.
• Reconfigurable System Integration: Family-level features for in-circuit reconfiguration and JTAG boundary-scan simplify updates and board-level testing.

Why Choose EPF10K130EFI484-2?

The EPF10K130EFI484-2 is positioned for designers who need a balance of programmable logic capacity, significant on-chip RAM, and a large number of I/Os in an industrial-rated package. Its combination of 6,656 logic elements, 65,536 bits of RAM, and 369 I/Os makes it suitable for embedded control, interface consolidation, and custom logic acceleration on space-constrained boards.

Choosing this device provides a reconfigurable platform with series-level features for in-circuit reconfigurability and boundary-scan support, enabling iterative development and easier board bring-up for long-life and field-updatable products.

Request a quote or submit an RFQ to obtain pricing, lead times, and availability for the EPF10K130EFI484-2.