EPF10K130EQC240-2N

The EPF10K130EQC240-2N is a FLEX-10KE family field programmable gate array (FPGA) in a 240-pin BFQFP/PQFP package. It combines configurable logic, on-chip RAM and a high I/O count to support medium-density custom logic and system integration tasks.

Designed for commercial applications, this device offers 6,656 logic elements, approximately 65,536 bits of embedded RAM, and 186 user I/O pins, delivering a balance of integration and I/O flexibility for embedded designs and prototype systems.

Key Features

• Configurable Logic — 6,656 logic elements for implementing custom digital functions and glue logic within a single device.
• Embedded Memory — Approximately 65,536 bits of on-chip RAM to support local buffering, FIFOs and small data tables.
• I/O Capacity — 186 user I/O pins provide flexible external interfacing options for sensors, peripherals and board-level interconnect.
• Supply Voltage — Operates from 2.375 V to 2.625 V, enabling designs that target the specified core voltage range.
• Package & Mounting — Offered in a 240-BFQFP package (supplier device package: 240-PQFP, 32×32); surface-mount package suitable for standard PCB assembly.
• Commercial Grade & Temperature — Commercial grade device rated for 0 °C to 70 °C operating temperature.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.
• Family-Level Capabilities — From the FLEX 10K family data: embedded programmable logic architecture supporting System-on-a-Programmable-Chip (SOPC) integration, in-circuit reconfigurability (ICR) options, JTAG boundary-scan, and built-in clock distribution features.

Typical Applications

• Embedded Control — Implement control logic, state machines and peripheral interfaces for embedded products requiring programmable customization.
• Prototyping & Development — Rapid hardware prototyping and algorithm verification where reprogrammability and moderate logic density are needed.
• Interface Bridging — Protocol conversion, bus bridging and glue logic between multiple digital subsystems using the device’s ample I/O resources.
• Memory-Intensive Logic — Local buffering, small lookup tables and FIFO implementations using the on-chip RAM to reduce external memory dependence.

Unique Advantages

• Balanced Logic Density — 6,656 logic elements provide a mid-range capacity for integrating multiple functions without excessive board count.
• Generous I/O — 186 user I/O pins enable complex interconnect and flexible peripheral attachments directly to the FPGA.
• On-Chip Memory — Approximately 65,536 bits of embedded RAM simplify designs that require local storage or buffering.
• Compact Surface-Mount Package — 240-pin BFQFP / 240-PQFP (32×32) packaging supports standard SMT assembly while offering a high pin count footprint.
• Commercial Temperature & RoHS Compliance — Suited for standard commercial applications with environmental compliance for assembly and manufacturing.
• Family-Level Integration Options — FLEX 10K family features include SOPC integration, in-circuit reconfigurability and JTAG boundary-scan for design flexibility and testability.

Why Choose EPF10K130EQC240-2N?

The EPF10K130EQC240-2N positions itself as a mid-density, commercially graded FPGA that combines a substantial logic element count, on-chip memory and a high number of user I/Os in a compact 240-pin surface-mount package. It is suitable for engineers who need reconfigurable logic and local memory to consolidate functions and reduce system complexity.

With family-level features such as in-circuit reconfigurability and JTAG boundary-scan, this device supports iterative development and test strategies while its supply-voltage and temperature specifications provide clear electrical and environmental operating constraints for commercial product designs.

Request a quote or submit a purchase inquiry to evaluate EPF10K130EQC240-2N for your next embedded or prototype design.