EPF10K130EQI240-2

The EPF10K130EQI240-2 is an Intel FLEX-10KE field programmable gate array packaged in a 240-pin BFQFP surface-mount package. It provides 6,656 logic elements, 65,536 bits of embedded RAM and 186 user I/O, delivering mid-to-high density programmable logic capacity for industrial and embedded applications.

As part of the FLEX 10K family, the device supports system-level integration for embedded programmable logic designs and is specified for industrial-grade operation across a –40°C to 85°C temperature range.

Key Features

• Logic Capacity – 6,656 logic elements and approximately 342,000 gates provide significant on-chip programmable logic for custom digital functions.
• Embedded Memory – 65,536 bits of on-chip RAM for buffering, state storage, and small data structures without external memory.
• I/O Resources – 186 user I/O pins support multiple external interface requirements in a single device package.
• Supply Voltage – Operates from 2.375 V to 2.625 V, enabling designs targeting that core supply range.
• Package & Mounting – 240-BFQFP (supplier package: 240-PQFP 32×32) in a surface-mount form factor for PCB assembly.
• Industrial Temperature & Grade – Rated for industrial operation from –40°C to 85°C and specified as Industrial grade.
• Standards & Compliance – RoHS compliant.
• FLEX 10K Family Features – Series-level capabilities documented for the FLEX 10K family include JTAG boundary-scan (IEEE 1149.1), FastTrack interconnect routing, dedicated carry and cascade chains, and ClockLock/ClockBoost options for clock distribution; these family features support system integration and advanced routing/clocking strategies.

Typical Applications

• Industrial Control – Mid-density programmable logic and industrial temperature rating make the device suitable for motor control logic, process control interfaces, and programmable automation tasks.
• Embedded Systems – Use as a configurable logic element within embedded platforms for custom peripheral implementation, protocol adaptation, and glue logic.
• Communications & I/O Bridging – 186 I/O pins and ample logic capacity enable protocol bridging, parallel/serial interface aggregation, and custom I/O handling.
• Custom Peripherals & Accelerators – On-chip RAM and dedicated logic resources support small on-device buffers and application-specific acceleration blocks.

Unique Advantages

• Balanced Logic and Memory: The combination of 6,656 logic elements and 65,536 bits of RAM offers a practical balance for designs that require both logic density and embedded storage without external memory.
• High I/O Count: 186 user I/O pins reduce the need for external interface components and simplify board-level integration.
• Industrial Suitability: Specified industrial temperature range (–40°C to 85°C) and Industrial grade classification support deployments in demanding environments.
• Compact Surface-Mount Package: 240-pin BFQFP surface-mount package provides a compact footprint for PCB space-constrained designs.
• Regulatory Compliance: RoHS compliance supports designs targeting regulatory-restricted markets and assemblies.
• FLEX 10K Family Ecosystem: Family-level design support and architecture features documented for FLEX 10K devices aid system-level integration and development productivity.

Why Choose EPF10K130EQI240-2?

The EPF10K130EQI240-2 offers a robust combination of logic capacity, embedded RAM, and a high I/O count in a 240-pin surface-mount package targeted at industrial and embedded applications. Its specification for industrial temperatures and RoHS compliance make it a practical choice for field-deployed systems where reliability and regulatory conformance matter.

As a member of the FLEX 10K family, the device aligns with a proven architecture and family-level design capabilities, enabling scalable designs and access to established development tools and methods. It is well suited to engineers seeking a mid-to-high density programmable logic device for custom peripherals, interface bridging, and system integration tasks.

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