EPF10K130EQC240-3N

The EPF10K130EQC240-3N is a FLEX-10KE® field programmable gate array (FPGA) manufactured by Intel. It is an embedded programmable logic device designed for system-level integration, supporting on-chip memory and configurable logic for custom digital functions.

With 6,656 logic elements, approximately 65.5 kbits of on-chip RAM, and 186 user I/O pins in a 240-BFQFP package, the device targets applications that require medium-density logic, flexible I/O, and board-level integration within commercial temperature ranges.

Key Features

• Core Logic  6,656 logic elements provide programmable resources for implementing combinational and sequential logic functions.
• Logic Array Blocks  832 logic array blocks (LABs) enable structured placement of logic for predictable routing and synthesis.
• Embedded Memory  Approximately 65.5 kbits of total on-chip RAM to support buffering, state storage, and small embedded data structures.
• I/O Density  186 user I/O pins to accommodate parallel interfaces, control signals, and mixed I/O requirements in a single device.
• Package  240-BFQFP (240-PQFP, 32×32) surface-mount package for board-level compatibility and reliable solder mounting.
• Power Supply  Specified supply voltage range of 2.375 V to 2.625 V to match targeted board power rails.
• Operating Conditions  Commercial grade operation from 0 °C to 70 °C, suitable for standard commercial electronics environments.
• Series-Level System Features  FLEX 10K family capabilities include embedded array support for megafunctions, in-circuit reconfigurability via external configuration devices or JTAG, and built-in IEEE 1149.1-compliant JTAG boundary-scan for board-level testability.
• Flexible Interconnect and Arithmetic Support  Series features such as FastTrack interconnect and dedicated carry/cascade resources enable efficient implementation of adders, counters, and high-fan-in logic (as documented for the FLEX 10K family).
• Compliance  RoHS compliant, meeting common environmental restrictions for electronic components.

Typical Applications

• Embedded Systems and SOPC Integration  Use the device to implement system-on-a-programmable-chip (SOPC) functions where on-chip memory and configurable logic simplify integration of custom peripherals and control logic.
• Interface and I/O Aggregation  High I/O count supports aggregation of parallel buses, custom I/O protocols, and board-level interface bridging.
• Custom Logic and Prototyping  Medium-density logic makes the device suitable for proof-of-concept designs, firmware offload, and feature prototyping without redesigning fixed silicon.
• Memory-Backed Control Functions  On-chip RAM supports buffering, lookup tables, and small data caches for control and signal-processing tasks.

Unique Advantages

• Balanced Logic and Memory  6,656 logic elements combined with ~65.5 kbits of RAM provide a useful balance for designs needing both programmable logic and embedded storage.
• High I/O Count in a Compact Package  186 user I/O pins in a 240-pin BFQFP package allow dense board integration while preserving signal access for peripherals and connectors.
• Designed for Board-Level Test and Reconfiguration  IEEE 1149.1-compliant JTAG boundary-scan and support for in-circuit reconfiguration improve manufacturability and field update capability.
• Commercial Temperature Rating  Specified 0 °C to 70 °C operation aligns with mainstream commercial electronics and consumer product use cases.
• RoHS Compliance  Environmentally compliant manufacturing reduces regulatory friction for commercial products.

Why Choose EPF10K130EQC240-3N?

The EPF10K130EQC240-3N positions itself as a medium-density FLEX-10KE FPGA that blends programmable logic, embedded RAM, and extensive I/O in a single 240-BFQFP package. It is suited for designers seeking a commercially rated, reconfigurable device for embedded control, interface aggregation, and prototyping tasks where board-level testability and reconfigurability are important.

With manufacturer support from Intel and series-level FLEX 10K features such as JTAG boundary-scan and configurable interconnect resources, this device offers a practical path to scalable designs that benefit from on-chip memory and flexible logic allocation.

Request a quote or submit an inquiry to receive pricing and availability for the EPF10K130EQC240-3N. Our team can provide lead-time details and assist with procurement and deployment planning.