EPF10K130VBC600-2

The EPF10K130VBC600-2 is a commercial-grade FLEX-10K® FPGA from Altera designed for mid-range logic integration and high pin-count applications. It provides 6,656 logic elements, approximately 0.033 Mbits of embedded RAM, and 470 user I/O in a compact 600-BGA (45×45) surface-mount package.

This device is suited to commercial and consumer electronic designs that require a balance of logic capacity, on-chip memory, and extensive I/O while operating from a 3.0 V to 3.6 V supply within a 0 °C to 70 °C temperature range.

Key Features

• Logic Capacity  6,656 logic elements provide mid-range combinational and sequential logic resources for glue logic, control state machines, and moderate DSP or protocol tasks.
• Embedded Memory  Approximately 0.033 Mbits (32,768 bits) of on-chip RAM for small buffers, FIFOs, and register files to support embedded data handling.
• High I/O Count  470 user I/O pins enable broad interfacing to peripherals, sensors, memory, and external logic in I/O-heavy systems.
• Gate Equivalent  Approximately 211,000 gates for translating design complexity into a measurable device capacity.
• Supply and Power  Operates from a 3.0 V to 3.6 V supply to match common commercial power rails.
• Package & Mounting  600-ball BGA (45×45 mm) surface-mount package for compact board layout and reliable soldered connections.
• Commercial Temperature Range  Rated for 0 °C to 70 °C operation, appropriate for commercial and consumer applications.
• RoHS Compliant  Device is RoHS compliant to support lead-free assembly processes and environmental regulations.

Typical Applications

• Consumer Electronics  Interface and control logic for devices that require moderate logic density and extensive I/O connectivity.
• Embedded Control  Control engines, protocol bridging, and custom peripheral interfaces in commercial embedded systems.
• Prototyping & Development  Hardware validation and development platforms where mid-range FPGA capacity and many I/O are needed.
• Communications and I/O Aggregation  Aggregating signals, protocol conversion, and glue logic in systems with diverse external interfaces.

Unique Advantages

• Balanced Logic and Memory: 6,656 logic elements combined with on-chip RAM enable compact implementations of control logic and small buffering without external memory.
• Extensive External Connectivity: 470 I/O pins allow designers to connect numerous peripherals and interfaces directly to the FPGA.
• Compact BGA Footprint: The 600-BGA (45×45) package supports high pin count in a space-efficient form factor suitable for dense board layouts.
• Commercial Voltage Compatibility: 3.0 V to 3.6 V supply range aligns with common commercial power rails for straightforward integration.
• Regulatory-Friendly: RoHS compliance supports lead-free assembly and aligns with common environmental requirements.

Why Choose EPF10K130VBC600-2?

The EPF10K130VBC600-2 delivers a practical combination of mid-range logic resources, embedded memory, and very high I/O count in a compact BGA package, making it a fit for commercial and consumer designs that require moderate complexity without large external memory or extremely high logic density. Manufactured by Altera, it provides predictable electrical and thermal operating conditions across a 3.0 V–3.6 V supply and 0 °C–70 °C temperature range.

Choose this device when your design prioritizes I/O capacity, compact PCB footprint, and RoHS-compliant assembly for commercial applications that demand scalable, reliable FPGA functionality.

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