EPF10K130EQI240-2N

IC FPGA 186 I/O 240QFP
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 186 65536 6656 240-BFQFP

Quantity 1,160 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFPNumber of I/O186Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells6656
Number of Gates342000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of EPF10K130EQI240-2N – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 186 65536 6656 240-BFQFP

The EPF10K130EQI240-2N is a FLEX-10KE family FPGA from Intel designed for embedded programmable logic applications. It combines a mid/high density logic fabric with embedded RAM and flexible I/O in a 240-pin PQFP package, targeted at industrial applications requiring reconfigurable system integration and on-chip memory.

As a member of the FLEX 10K family, this device supports system-level features such as in-circuit reconfigurability and boundary-scan, enabling use in SOPC integration, specialized logic functions, and designs that demand robust I/O and temperature performance.

Key Features

  • Logic Capacity  6,656 logic elements (device specification) providing substantial programmable logic for mid-range FPGA designs.
  • Embedded Memory  Total on-chip RAM of 65,536 bits, suitable for local buffering, state storage, and small embedded data structures.
  • I/O  186 user I/O pins to support a broad range of external interfaces and peripheral connections.
  • Gate Equivalent  Approximately 342,000 gates as a measure of overall device density and integration capability.
  • Power Supply  Core supply range of 2.375 V to 2.625 V for system-level power planning and compatibility with compatible power rails.
  • Industrial Temperature  Rated for operation from −40 °C to 85 °C and specified as Industrial grade for use in harsher environments.
  • Package & Mounting  240-BFQFP (240-PQFP, 32×32) package in surface-mount format to suit through-board reflow assembly and compact PCB layouts.
  • Configuration & Test  FLEX 10K family capabilities such as in-circuit reconfigurability (ICR) and IEEE Std. 1149.1 JTAG boundary-scan support are provided for flexible configuration and manufacturing test.
  • System Features  Family-level architecture includes features like dedicated carry and cascade chains and clock distribution options to support arithmetic and high fan-in logic functions.
  • Compliance  RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC)  Integrate embedded logic and memory into single-chip SOPC architectures for custom control and processing functions.
  • Embedded Memory and Megafunctions  Implement specialized on-chip functions such as small memory buffers, FIFOs, and control logic using the device’s embedded RAM and logic elements.
  • Industrial Control  Use in industrial automation and control systems where industrial temperature rating, flexible I/O, and reconfigurability are required.
  • Peripheral and Interface Logic  Implement custom interface bridging, glue logic, and protocol adaptation across multiple I/O signals.

Unique Advantages

  • Balanced Logic and Memory  With 6,656 logic elements and 65,536 bits of on-chip RAM, the part supports designs that need both moderate logic density and local storage without external memory.
  • Flexible I/O Count  186 user I/Os provide designers the flexibility to connect a wide range of peripherals and buses directly to the FPGA.
  • Industrial Thermal Margin  Rated operation from −40 °C to 85 °C supports deployment in industrial environments where temperature resilience matters.
  • Reconfigurability and Testability  In-circuit reconfigurability and JTAG boundary-scan support enable iterative development, field updates, and manufacturing test strategies.
  • Predictable Integration  Family-level architectural features such as dedicated carry/cascade chains and structured clock distribution simplify implementation of arithmetic and high-fan-in logic, reducing design iteration.
  • RoHS Compliance  Meets RoHS requirements for regulatory and environmental considerations in modern assemblies.

Why Choose EPF10K130EQI240-2N?

The EPF10K130EQI240-2N positions itself as a robust mid/high-density FLEX-10KE device that balances programmable logic, embedded RAM, and a substantial I/O count in a compact surface-mount PQFP package. Its industrial temperature rating and family-level features for reconfigurability and boundary-scan make it suitable for teams building configurable control, interface, and embedded processing solutions.

Designers and procurement teams looking for an FPGA that delivers moderate logic capacity, integrated memory, and flexible I/O with industrial-grade operating range will find this device suited to applications that require field updateability, in-system test, and compact board-level integration.

Request a quote or submit a product inquiry to evaluate EPF10K130EQI240-2N for your design; provide your requirements and our team will respond with pricing, availability, and technical information.

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