EPF10K130EQC240-3

The EPF10K130EQC240-3 is a FLEX-10KE family field programmable gate array (FPGA) in a 240‑pin BFQFP package. It provides a mid/high-density programmable fabric with dedicated embedded memory and a large user I/O count for system integration and custom logic functions.

Targeted at commercial-grade embedded designs, this device combines 6,656 logic elements, embedded RAM, and 186 user I/O pins to support interface bridging, protocol handling, and on-board logic acceleration while meeting RoHS requirements.

Key Features

• Logic Capacity — 6,656 logic elements organized across 832 LABs for implementing combinational and sequential logic.
• Gate Count — Approximately 342,000 gates of logic capacity as specified for this part number.
• Embedded Memory — Total on-chip RAM of 65,536 bits (approximately 64 kbits) for FIFOs, buffers, and state storage.
• User I/O — 186 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• In‑Circuit Reconfiguration & Test — Series-level support for in-circuit reconfigurability and built-in JTAG boundary-scan test circuitry (IEEE 1149.1) for programming and board-level test.
• Package & Mounting — 240-BFQFP surface-mount package (supplier package noted as 240‑PQFP, 32×32 mm) for compact board implementations.
• Power & Operating Range — Supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 70 °C.
• Regulatory — RoHS compliant, supporting environmental compliance requirements for commercial products.

Typical Applications

• Embedded Control & Logic Acceleration — Implement custom controllers, glue logic, and acceleration blocks where deterministic programmable logic and embedded RAM are required.
• Interface Bridging & Protocol Conversion — Use the device’s large I/O count to bridge multiple buses or translate between interfaces on a single PCB footprint.
• Prototyping & System Integration — Rapidly validate and integrate system functions using the FLEX‑10KE architecture and in‑circuit reconfiguration options.
• On‑board Buffering & Data Handling — Embedded RAM supports buffering, FIFOs, and small data stores for real-time data paths and streaming applications.

Unique Advantages

• Substantial Logic Resource Set: 6,656 logic elements and ~342,000 gates provide the capacity to implement complex logic and control functions without external ASICs.
• Integrated RAM for Local Storage: 65,536 bits of on-chip RAM reduce external memory dependency for buffering and state machines, simplifying BOM and board routing.
• High I/O Count: 186 user I/O pins enable multi‑bus connectivity and rich peripheral interfaces directly from the FPGA package.
• Standard Surface‑Mount Package: 240‑pin BFQFP (32×32 supplier PQFP) offers a balance of pin count and PCB area for commercial electronics.
• Commercial‑Grade and RoHS Compliant: Suited to commercial temperature ranges and compliant with RoHS environmental requirements.
• Reconfigurability and Testability: Supports in‑circuit reconfiguration and JTAG boundary-scan for flexible development and board-level test strategies.

Why Choose EPF10K130EQC240-3?

The EPF10K130EQC240-3 delivers a well-balanced combination of logic capacity, embedded memory, and a high user I/O count in a compact 240‑pin BFQFP package, making it suitable for commercial embedded designs that require on‑board programmability and moderate memory resources. Its commercial operating range, RoHS compliance, and support for in‑circuit reconfiguration and JTAG-based testability help streamline development and manufacturing.

This part is appropriate for engineering teams developing interface-heavy systems, protocol bridges, control logic, and prototype systems that benefit from a flexible, programmable device within the FLEX‑10KE family architecture.

If you would like pricing, lead-time details, or help specifying quantities for production, request a quote or submit a procurement inquiry through your preferred purchasing channel.