EPF10K130EQC240-1

The EPF10K130EQC240-1 is a FLEX-10KE family FPGA from Intel, packaged in a 240-BFQFP surface-mount package. It combines a medium-density logic array with embedded memory and a substantial I/O count to support reconfigurable system functions in commercial-grade designs.

With 6,656 logic elements, 65,536 total RAM bits and 186 user I/O pins, this device is suited for embedded systems, communications interfaces, consumer electronics and development/prototyping applications that require on-chip integration and in-circuit reconfigurability.

Key Features

• Logic Capacity — 6,656 logic elements (LEs) equivalent to 342,000 gates, enabling implementation of medium-density logic and glue logic on a single device.
• On-chip Memory — 65,536 total RAM bits for buffering, state machines and small data structures.
• I/O and Voltage — 186 user I/O pins with a specified supply voltage range of 2.375 V to 2.625 V to match system power rails.
• Package and Mounting — 240-BFQFP (supplier device package: 240-PQFP 32×32) in a surface-mount form factor; commercial grade with an operating temperature range of 0 °C to 70 °C.
• Reconfigurability and Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE 1149.1 JTAG boundary-scan test circuitry (per FLEX 10K family datasheet).
• System-Level Architecture — Series-level features include dedicated carry and cascade chains, low-skew clock distribution, and a flexible interconnect structure for predictable routing delays (as described in the FLEX 10K family documentation).
• Compliance — RoHS compliant for reduced hazardous substances in the supply chain.

Typical Applications

• Embedded Systems — Implement control logic, protocol handling and peripheral interfacing where reconfigurable logic and on-chip memory reduce external components.
• Communications & Networking — Implement interface bridging, packet parsing, or custom timing logic using the device’s dedicated arithmetic and cascade resources.
• Consumer Electronics — Provide glue logic, user-interface control and feature customization in consumer devices where space-efficient QFP packaging is required.
• Prototyping & Development — Rapidly iterate hardware designs and verify logic functions with in-circuit reconfigurability and JTAG boundary-scan support.

Unique Advantages

• Balanced Integration: Combines 6,656 logic elements and 65,536 RAM bits to consolidate functions that would otherwise require multiple discrete parts.
• Substantial I/O Count: 186 user I/Os allow direct interfacing to multiple peripherals and bus standards without external expanders.
• Reconfigurable In-System: In-circuit reconfigurability and JTAG support streamline firmware/hardware updates and boundary-scan testing.
• Predictable Timing Architecture: Series-level features such as dedicated carry/cascade chains and a low-skew clock distribution help maintain consistent timing for arithmetic and high-fan-in logic.
• Commercial Packaging: 240-pin BFQFP surface-mount package provides a compact footprint for board-level designs targeting commercial temperature ranges.
• RoHS Compliance: Meets RoHS requirements for environmentally conscious product assemblies.

Why Choose EPF10K130EQC240-1?

The EPF10K130EQC240-1 delivers a practical balance of logic capacity, embedded memory and I/O count in a compact 240-BFQFP surface-mount package for commercial applications. It is well suited to designers who need a reconfigurable, medium-density FPGA to reduce board-level BOM and centralize control logic and buffering.

As part of the FLEX 10K family, this device benefits from documented series-level architecture and development tool support for design entry and automatic place-and-route, enabling faster integration into existing development flows and scaled designs.

Request a quote or submit a purchase request to obtain pricing and availability information for EPF10K130EQC240-1.