EPF10K250ABC600-2

The EPF10K250ABC600-2 is a FLEX-10K® field programmable gate array from Altera, provided in a 600-ball BGA (45×45) surface-mount package. It delivers a balance of logic capacity, I/O density and on-chip memory for commercial embedded designs.

With 12,160 logic elements, up to 470 general-purpose I/O pins and approximately 0.04 Mbits of embedded memory, this device is suited to commercial applications that require significant logic integration and flexible I/O routing within a compact BGA footprint.

Key Features

• Logic Capacity — 12,160 logic elements and approximately 310,000 equivalent gates provide substantial digital resource for medium-complexity designs.
• On-chip Memory — 40,960 bits of embedded RAM (approximately 0.04 Mbits) to support buffering, state storage and small data tables without external memory.
• I/O Density — Up to 470 I/O pins for extensive interfacing to peripherals, sensors and bus systems.
• Package and Mounting — 600-BGA (45×45) ball grid array in a surface-mount form factor to maximize board-level routing while minimizing footprint.
• Power Supply — Operates from a 3.0 V to 3.6 V supply range to match common commercial logic rails.
• Operating Range — Commercial temperature rating from 0 °C to 70 °C for standard indoor and non-extreme-environment applications.
• Regulatory — RoHS compliant for environmental and lead-free assembly requirements.

Typical Applications

• Commercial Embedded Systems — Use as the programmable logic core in control and processing modules that require up to 12,160 logic elements and dense I/O.
• Prototyping and Development — Suitable for FPGA-based prototypes where medium logic capacity and a high pin count are needed to validate interfaces and system logic.
• Connectivity and I/O Expansion — High I/O count supports bridging, protocol conversion and I/O-expansion tasks in consumer and commercial equipment.

Unique Advantages

• High Logic Integration: 12,160 logic elements enable consolidation of multiple functions into a single programmable device, reducing component count.
• Extensive I/O: 470 I/O pins allow flexible interfacing and simplify board-level design when connecting numerous peripherals.
• Compact BGA Footprint: 600-BGA (45×45) packaging provides a high-pin-count solution in a compact surface-mount form factor for space-constrained boards.
• Standard Commercial Temperature: Rated 0 °C to 70 °C for reliable operation in typical indoor and commercial environments.
• RoHS Compliant: Meets lead-free and environmental compliance requirements for modern assembly processes.
• Compatible Power Range: 3.0 V to 3.6 V operation aligns with common system voltage rails for simplified power design.

Why Choose EPF10K250ABC600-2?

The EPF10K250ABC600-2 combines substantial logic resources, a high I/O count and on-chip RAM in a compact 600-BGA package, making it well suited for commercial embedded applications that require dense programmable logic and flexible interfacing. Its commercial temperature rating and RoHS compliance match typical production and environmental requirements for consumer and commercial equipment.

Designed and supplied by Altera, this FLEX-10K® device is appropriate for engineers and teams seeking a scalable, integrated FPGA solution for mid-range designs where board space, I/O capacity and consolidation of functions are priorities.

Request a quote or submit an RFQ to receive pricing and availability information for the EPF10K250ABC600-2.