EPF10K250AGC599-2

LOADABLE PLD, 0.6NS CPGA599
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 470 40960 12160 599-BCPGA

Quantity 91 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package599-CPGA (62.48x62.48)GradeCommercialOperating Temperature0°C – 70°C
Package / Case599-BCPGANumber of I/O470Voltage3 V - 3.6 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs1520Number of Logic Elements/Cells12160
Number of Gates310000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EPF10K250AGC599-2 – FLEX-10K® Field Programmable Gate Array (FPGA) IC

The EPF10K250AGC599-2 is a FLEX-10K® field programmable gate array (FPGA) IC from Altera designed for commercial-grade electronic designs. It delivers a mid-range combination of programmable logic, on-chip memory, and a large I/O count for board-level implementations.

Key hardware attributes include 12,160 logic elements, approximately 310,000 gates, 40,960 bits of total on-chip RAM and 470 user I/O pins. The device ships in a 599-BCPGA package (599-CPGA, 62.48 × 62.48 mm), is through-hole mountable, and operates from 3.0 V to 3.6 V over a 0 °C to 70 °C commercial temperature range. The part is RoHS compliant.

Key Features

  • Core Logic  12,160 logic elements and approximately 310,000 gates provide substantial programmable logic capacity for glue logic, protocol bridging, and custom datapaths.
  • Embedded Memory  40,960 bits of total on-chip RAM for FIFOs, buffering and small on-chip data storage needs.
  • I/O Density  470 user I/O pins support extensive external interfacing and board-level connectivity.
  • Package & Mounting  599-BCPGA package (supplier device package: 599-CPGA, 62.48 × 62.48 mm) with through-hole mounting for secure board attachment and handling.
  • Power  Operates from 3.0 V to 3.6 V, enabling compatibility with common 3.3 V system rails.
  • Operating Range & Grade  Commercial grade operation from 0 °C to 70 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Substantial programmable logic: 12,160 logic elements give designers the ability to implement complex control and data-processing logic on a single FPGA.
  • High gate density: Approximately 310,000 gates support larger logic designs and finer-grain implementations without external glue logic.
  • Ample on-chip RAM: 40,960 bits of embedded memory reduce dependence on external SRAM for modest buffering and state storage.
  • Extensive I/O capability: 470 I/O pins enable broad peripheral and signal connectivity for multi-device or sensor-rich systems.
  • Robust package and mounting: The 599-BCPGA package with through-hole mounting simplifies handling and assembly for board-level integration.
  • Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EPF10K250AGC599-2?

The EPF10K250AGC599-2 combines mid-range programmable logic capacity, significant I/O, and embedded memory in a through-hole 599-BCPGA package for commercial electronic designs. It is well suited to projects that require on-chip integration of control logic, data buffering and extensive external interfacing within common 3.0 V–3.6 V systems.

As part of the FLEX-10K family, this FPGA offers a balance of integration and board-level practicality for design teams and procurement seeking a commercial-grade, RoHS-compliant programmable device with clear power and temperature specifications.

Request a quote or submit an RFQ for the EPF10K250AGC599-2 to receive pricing and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up