EPF10K30ABC356-1

The EPF10K30ABC356-1 is a FLEX-10KA family field programmable gate array from Intel designed for embedded programmable logic applications. It combines a logic array and embedded memory to implement specialized functions and system integration tasks.

With 1,728 logic elements, 12,288 bits of on-chip RAM and up to 246 I/O pins in a 356-ball LBGA package, this device targets commercial embedded systems requiring moderate logic density, flexible I/O and in-circuit reconfigurability.

Key Features

• Programmable Logic Capacity — 1,728 logic elements provide resources for implementing custom combinational and sequential logic functions within embedded designs.
• On‑Chip Memory — 12,288 total RAM bits of embedded memory support data buffering, small FIFOs and state storage without external RAM.
• I/O and Connectivity — Up to 246 user I/O pins accommodate multiple parallel interfaces, buses and peripheral connections in a single device.
• Gate Count — 69,000 gates (maximum system gates) enable integration of significant logic and memory functions on-chip.
• Configuration and Test — Built‑in JTAG boundary-scan test (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or the JTAG port simplify programming and board-level test.
• Power Supply — Designed to operate from 3 V to 3.6 V supply rails to match common 3.3 V system voltages.
• Package and Mounting — 356-ball LBGA (35 × 35) package in a surface-mount form factor supports compact board layouts.
• Commercial Temperature Grade — Specified for operation from 0 °C to 70 °C for commercial embedded applications.
• RoHS Compliant — Meets RoHS requirements for materials compliance.

Typical Applications

• Embedded controller and glue logic — Use the device to consolidate glue logic and peripheral interfacing where up to 246 I/O and moderate logic density simplify board design.
• Interface bridging — On‑chip RAM and abundant I/O make the device suitable for buffering and protocol conversion between parallel and serial buses in commercial systems.
• Prototyping and development — Reconfigurability and JTAG support enable rapid iteration for proof-of-concept and prototype designs.
• Small-scale signal processing — The combination of logic elements and embedded RAM supports custom datapath implementations and small FIFO/buffer structures.

Unique Advantages

• Balanced integration: Combines 1,728 logic elements with 12,288 bits of embedded RAM to reduce external component count and simplify BOM.
• Generous I/O capacity: 246 user I/O pins accommodate multiple interfaces and peripherals without external multiplexing.
• Compact package: 356-LBGA surface-mount package helps maximize board density while supporting high pin counts.
• Design and test support: Built-in IEEE 1149.1 JTAG boundary-scan simplifies board-level testing and in-circuit programming.
• Commercial-ready: Specified for 0 °C to 70 °C operation and RoHS compliant for standard commercial product deployments.
• Flexible power options: Operates from a 3.0 V to 3.6 V supply range to match common 3.3 V system rails.

Why Choose EPF10K30ABC356-1?

The EPF10K30ABC356-1 positions itself as a mid-density, flexible FPGA solution within the FLEX-10KA family, combining programmable logic, embedded memory and a high I/O count in a compact LBGA package. It is suitable for designers who need to consolidate logic, implement custom interfaces and maintain board-level testability in commercial embedded products.

For projects that require moderate gate density, on‑chip RAM and a 3.3 V-compatible supply range, this device offers a balanced platform with in-circuit reprogramming and IEEE 1149.1 boundary-scan support, helping teams accelerate integration and maintainability while leveraging Intel’s FLEX-10KA family architecture.

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