EPF10K30ABC356-3

The EPF10K30ABC356-3 is an Intel FLEX-10KA family field programmable gate array supplied in a 356-BGA (35 × 35) surface-mount package. It provides embedded programmable logic and on-chip memory intended for system-on-a-programmable-chip (SOPC) integration, enabling implementation of specialized logic functions and embedded memory blocks within a single device.

With 1,728 logic elements, 12,288 bits of embedded RAM and 246 user I/O pins, this commercial-grade device is suited to embedded systems, communications and custom logic functions where moderate gate density, configurable I/O and compact packaging are required.

Key Features

• Logic Capacity — 1,728 logic elements provide flexible programmable logic resources for implementing combinational and sequential functions.
• Embedded Memory — 12,288 total RAM bits of on-chip memory to support buffers, small lookup tables and megafunctions without consuming external memory.
• I/O — 246 user I/O pins for broad external connectivity and interface flexibility in dense designs.
• Gate Count — Up to 69,000 system gates available, enabling integration of substantial logic and system functions on-chip.
• Package & Mounting — 356-LBGA (356-BGA, 35 × 35) surface-mount package for board-area efficient placement in space-constrained layouts.
• Power Range — Operates from 3.0 V to 3.6 V supply, suitable for 3.3 V system environments.
• Operating Conditions — Commercial-grade temperature range from 0 °C to 70 °C for typical commercial environments.
• Reconfigurability & Test — Supports in-circuit reconfiguration and includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1 for device programming and board-level testability (as described in the FLEX 10K family datasheet).
• Standards & Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Implement on-chip control logic, glue logic and small memory buffers to consolidate system functionality.
• Communication Interfaces — Provide configurable I/O and custom protocol handling using the device’s programmable logic and 246 I/O pins.
• Custom Digital Functions — Accelerate development of application-specific logic, state machines and data path functions with reprogrammable logic elements.
• Prototyping & Development — Use the FLEX-10KA architecture for proof-of-concept designs and early-stage system validation that require in-circuit reconfiguration and boundary-scan test support.

Unique Advantages

• Balanced Logic and Memory — A combination of 1,728 logic elements and 12,288 bits of embedded RAM lets you implement both control logic and small on-chip data storage without external components.
• High I/O Density — 246 I/O pins deliver extensive connectivity options for complex interfaces while keeping a compact board footprint with the 356-LBGA package.
• Programmable and Testable — In-circuit reconfigurability and IEEE 1149.1 JTAG support simplify development cycles and enable board-level testability.
• Compact Packaging — 356-BGA (35 × 35) minimizes PCB area, supporting dense system designs where board space is at a premium.
• Commercial-Grade Reliability — Designed for 0 °C to 70 °C operation and RoHS compliance for standard commercial product deployments.

Why Choose EPF10K30ABC356-3?

The EPF10K30ABC356-3 delivers a practical blend of programmable logic, embedded memory and high I/O count in a compact 356-LBGA package. Its FLEX-10KA architecture supports SOPC-style integration and on-chip megafunctions, making it a solid choice for designers who need moderate-density FPGA resources, embedded RAM and flexible interfacing within commercial temperature environments.

This device is well suited to engineers and teams building embedded controllers, custom interface logic and prototype systems who value in-circuit reconfigurability, JTAG-based testability and a compact board-level footprint. Its specification set supports scalable designs that benefit from on-chip memory and abundant I/O without increasing PCB area.

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