EPF10K30AFC256-1

IC FPGA 191 I/O 256FBGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 191 12288 1728 256-BGA

Quantity 24 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AFC256-1 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 191 12288 1728 256-BGA

The EPF10K30AFC256-1 is a FLEX 10KA family FPGA offering embedded programmable logic and on-chip memory suitable for system-level integration. It combines a logic array and embedded array blocks to implement general logic functions, efficient memory structures and specialized megafunctions for embedded designs.

Targeted at commercial embedded and system applications, this device provides a balance of logic capacity, on-chip RAM and I/O density in a 256-ball FBGA package while supporting in-circuit reconfigurability and standard boundary-scan testing for board-level integration and validation.

Key Features

  • Logic Capacity  Approximately 1,728 logic elements organized across 216 LABs, supporting up to 69,000 system gates for complex control and processing logic.
  • Embedded Memory  Total on-chip RAM of 12,288 bits provided by embedded array blocks (EABs) to implement FIFOs, buffers and small memory-mapped functions without external RAM.
  • I/O and Bus Support  191 user I/O pins with MultiVolt I/O support and 5.0-V tolerant input capability on FLEX 10KA devices, enabling mixed-voltage interfacing and bus integration.
  • Voltage and Power  Designed for a primary supply range of 3.0 V to 3.6 V, suitable for 3.3 V systems common in commercial embedded applications.
  • Package and Mounting  Surface-mount 256-FBGA (17×17) package for compact board footprint and improved board-level routing density.
  • Temperature and Grade  Commercial-grade device rated for 0 °C to 70 °C operating temperature.
  • Configuration and Test  Supports in-circuit reconfigurability via external configuration device, intelligent controller or JTAG, with IEEE 1149.1-compliant boundary-scan test circuitry for board-level verification.
  • Clocking and Interconnect  Built-in low-skew clock distribution trees and dedicated carry and cascade chains to support arithmetic and high-fan-in logic functions efficiently.
  • Compliance  RoHS-compliant manufacturing.

Typical Applications

  • Embedded System Integration  Implement on-chip control logic and megafunctions for SOPC-style designs where programmable logic and embedded memory reduce external component count.
  • Interface Bridging and Bus Support  Use the device’s MultiVolt I/O and 5.0-V tolerant inputs to bridge mixed-voltage peripherals and support common bus interfaces in commercial systems.
  • Memory-Intensive Logic  Leverage the device’s embedded array blocks and 12,288 bits of on-chip RAM for FIFOs, buffering and small data stores within complex logic flows.
  • Board-Level Test and Validation  Employ JTAG boundary-scan for manufacturing test, in-system programming and debug without consuming general-purpose logic resources.

Unique Advantages

  • Highly Integrated Solution: Combines logic elements and embedded RAM in a single FLEX 10KA device to simplify system design and reduce BOM.
  • Mixed-Voltage Interfacing: MultiVolt I/O and 5.0-V tolerant input capability allow straightforward connection to a variety of peripheral voltage domains.
  • Compact Board Footprint: 256-FBGA (17×17) surface-mount package maximizes board space efficiency for dense designs.
  • Production-Ready Testability: IEEE 1149.1 JTAG boundary-scan support enables in-system programming and standardized board-level testing.
  • On-Device Memory: Approximately 12,288 bits of embedded RAM reduce reliance on external memory for small data structures and buffering.
  • Developer Tool Support: Part of the FLEX 10K family with available Altera development system support for place-and-route and megafunction integration.

Why Choose EPF10K30AFC256-1?

The EPF10K30AFC256-1 delivers a balanced mix of logic resources, embedded memory and I/O density tailored for commercial embedded designs that require in-system configurability and board-level testability. Its FLEX 10KA architecture provides dedicated logic features such as carry and cascade chains plus low-skew clock distribution to support efficient implementation of arithmetic and high-fan-in logic functions.

This device suits designers who need a commercially graded FPGA with approximately 1,728 logic elements, 12,288 bits of on-chip RAM, and 191 I/Os in a compact 256-FBGA package—backed by the FLEX 10K family ecosystem and standard configuration and test options for streamlined development and production.

Request a quote to receive pricing and availability information for the EPF10K30AFC256-1.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up