EPF10K30AFC256-1

The EPF10K30AFC256-1 is a FLEX 10KA family FPGA offering embedded programmable logic and on-chip memory suitable for system-level integration. It combines a logic array and embedded array blocks to implement general logic functions, efficient memory structures and specialized megafunctions for embedded designs.

Targeted at commercial embedded and system applications, this device provides a balance of logic capacity, on-chip RAM and I/O density in a 256-ball FBGA package while supporting in-circuit reconfigurability and standard boundary-scan testing for board-level integration and validation.

Key Features

• Logic Capacity  Approximately 1,728 logic elements organized across 216 LABs, supporting up to 69,000 system gates for complex control and processing logic.
• Embedded Memory  Total on-chip RAM of 12,288 bits provided by embedded array blocks (EABs) to implement FIFOs, buffers and small memory-mapped functions without external RAM.
• I/O and Bus Support  191 user I/O pins with MultiVolt I/O support and 5.0-V tolerant input capability on FLEX 10KA devices, enabling mixed-voltage interfacing and bus integration.
• Voltage and Power  Designed for a primary supply range of 3.0 V to 3.6 V, suitable for 3.3 V systems common in commercial embedded applications.
• Package and Mounting  Surface-mount 256-FBGA (17×17) package for compact board footprint and improved board-level routing density.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 70 °C operating temperature.
• Configuration and Test  Supports in-circuit reconfigurability via external configuration device, intelligent controller or JTAG, with IEEE 1149.1-compliant boundary-scan test circuitry for board-level verification.
• Clocking and Interconnect  Built-in low-skew clock distribution trees and dedicated carry and cascade chains to support arithmetic and high-fan-in logic functions efficiently.
• Compliance  RoHS-compliant manufacturing.

Typical Applications

• Embedded System Integration  Implement on-chip control logic and megafunctions for SOPC-style designs where programmable logic and embedded memory reduce external component count.
• Interface Bridging and Bus Support  Use the device’s MultiVolt I/O and 5.0-V tolerant inputs to bridge mixed-voltage peripherals and support common bus interfaces in commercial systems.
• Memory-Intensive Logic  Leverage the device’s embedded array blocks and 12,288 bits of on-chip RAM for FIFOs, buffering and small data stores within complex logic flows.
• Board-Level Test and Validation  Employ JTAG boundary-scan for manufacturing test, in-system programming and debug without consuming general-purpose logic resources.

Unique Advantages

• Highly Integrated Solution: Combines logic elements and embedded RAM in a single FLEX 10KA device to simplify system design and reduce BOM.
• Mixed-Voltage Interfacing: MultiVolt I/O and 5.0-V tolerant input capability allow straightforward connection to a variety of peripheral voltage domains.
• Compact Board Footprint: 256-FBGA (17×17) surface-mount package maximizes board space efficiency for dense designs.
• Production-Ready Testability: IEEE 1149.1 JTAG boundary-scan support enables in-system programming and standardized board-level testing.
• On-Device Memory: Approximately 12,288 bits of embedded RAM reduce reliance on external memory for small data structures and buffering.
• Developer Tool Support: Part of the FLEX 10K family with available Altera development system support for place-and-route and megafunction integration.

Why Choose EPF10K30AFC256-1?

The EPF10K30AFC256-1 delivers a balanced mix of logic resources, embedded memory and I/O density tailored for commercial embedded designs that require in-system configurability and board-level testability. Its FLEX 10KA architecture provides dedicated logic features such as carry and cascade chains plus low-skew clock distribution to support efficient implementation of arithmetic and high-fan-in logic functions.

This device suits designers who need a commercially graded FPGA with approximately 1,728 logic elements, 12,288 bits of on-chip RAM, and 191 I/Os in a compact 256-FBGA package—backed by the FLEX 10K family ecosystem and standard configuration and test options for streamlined development and production.

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