EPF10K30AFC484-2

IC FPGA 246 I/O 484FBGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA

Quantity 280 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O246Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AFC484-2 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 246 12288 1728 484-BBGA

The EPF10K30AFC484-2 is a member of the FLEX 10K embedded programmable logic device family. It combines a dedicated logic array and embedded memory resources to enable system-on-a-programmable-chip (SOPC) style integration for mid-density custom logic designs.

Targeted at commercial applications, this surface-mount FPGA provides a balanced mix of logic resources, I/O density, and on-chip RAM for tasks such as custom peripheral logic, bus interfacing, and embedded megafunction implementation.

Key Features

  • Logic Capacity — 1,728 logic elements and 216 logic array blocks (LABs) to implement combinational and sequential logic.
  • Gate Count — 69,000 gates (as specified) for system-level logic integration and glue logic.
  • Embedded Memory — 12,288 total RAM bits (approximately 0.012 Mbits) for on-chip data storage and FIFO/buffer structures.
  • I/O Density — 246 user I/O pins to support multiple peripherals and interface signals on a single device.
  • Package & Mounting — 484-ball BGA (484-BBGA) in a 23 × 23 FBGA footprint; surface-mount packaging for compact board designs.
  • Supply Voltage — Operates from 3.0 V to 3.6 V to match typical 3.3 V system rails.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Reconfigurability & Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; includes IEEE 1149.1 JTAG boundary-scan test circuitry.
  • Flexible Interconnect & Arithmetic Support — Family-level features include FastTrack continuous routing, dedicated carry chains, and cascade chains for efficient arithmetic and high-fan-in logic implementations.
  • Power & System Features — Family documentation highlights low-power standby behavior and multi-voltage I/O support; device-level supply is 3.0–3.6 V for this part.
  • Standards & Compliance — RoHS compliant (as provided in product data).

Typical Applications

  • Custom Peripheral Logic — Implement protocol translators, glue logic, and peripheral controllers using available logic elements and on-chip RAM.
  • Embedded Megafunctions — Use embedded array blocks for efficient implementation of small memories, FIFOs, and specialized logic functions inside a compact FPGA package.
  • Board-Level I/O Aggregation — High I/O count (246 pins) enables consolidation of multiple interfaces and signals onto a single device for simplified PCB routing.
  • System Integration & SOPC — Suitable where integration of multiple logic functions and local memory into a single component reduces BOM and board area.

Unique Advantages

  • Balanced Integration: Combines 1,728 logic elements with embedded RAM for both control and data-path implementations without external memory for small buffers.
  • High I/O Count in Compact Package: 246 I/O pins in a 484-BBGA footprint support dense signal routing while preserving board real estate.
  • Reconfigurable Design Flow: In-circuit reconfigurability and JTAG support simplify development cycles and field updates.
  • Design Performance Primitives: Dedicated carry and cascade chains accelerate arithmetic and high-fan-in logic functions, improving place-and-route efficiency.
  • Commercial Temperature and Supply Compatibility: 0 °C to 70 °C operating range and 3.0–3.6 V supply make the device compatible with standard 3.3 V systems.
  • Regulatory Compatibility: RoHS compliance supports use in lead-free manufacturing processes.

Why Choose EPF10K30AFC484-2?

The EPF10K30AFC484-2 delivers a practical combination of logic elements, embedded memory, and high I/O count in a compact BGA package for commercial applications. Its placement within the FLEX 10K family provides access to family-level features such as optimized interconnect, dedicated arithmetic chains, and JTAG-based testability—helpful for both prototyping and production designs.

This part is well suited for engineers and procurement teams seeking a commercially graded, reconfigurable device for mid-density system integration, peripheral consolidation, and embedded logic functions where a 3.3 V-compatible supply and high I/O density are required.

Request a quote or submit an inquiry with the EPF10K30AFC484-2 part number to receive pricing and availability details.

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