EPF10K30AQC208-1

The EPF10K30AQC208-1 is a FLEX-10KA family FPGA from Intel designed for embedded programmable logic applications. It combines a dedicated logic array and embedded memory to support system-level integration, reconfigurability and mixed-signal I/O interfacing for commercial designs.

Targeted at system designers and electronic OEMs, this device delivers a compact, surface-mount package with a balance of logic capacity, on-chip RAM and I/O count suitable for control, glue-logic, protocol bridging and embedded function acceleration.

Key Features

• Logic Capacity — 1,728 logic elements with approximately 69,000 system gates, providing programmable logic resources for combinational and sequential functions.
• Embedded Memory — 12,288 total RAM bits of on-chip memory for buffering, small FIFOs or lookup tables without consuming extra logic.
• I/O and Voltage — 147 user I/O pins with MultiVolt I/O support; device supply range specified at 3 V to 3.6 V for 3.3 V system operation.
• Package and Mounting — 208-BFQFP package, supplier device package listed as 208-PQFP (28×28), surface-mount mounting for PCB space-efficient integration.
• Family-Level Features — FLEX 10KA family capabilities including embedded array blocks for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and JTAG boundary-scan for in-circuit test and configuration.
• Reconfigurability — In-circuit reconfigurability supported via external configuration device or JTAG port, enabling field updates and prototype iteration.
• Operating Conditions — Commercial grade operation with an ambient temperature range of 0 °C to 70 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• Embedded Control — Implement custom control logic, glue logic and state machines using the device’s logic elements and on-chip RAM.
• Interface Bridging — Use the flexible I/O and reconfigurable logic to bridge between different buses and peripherals in mixed-voltage systems.
• Prototyping and Development — Rapidly iterate hardware functions and validate algorithms with in-circuit reconfigurability and JTAG access.
• Signal Processing & Glue Functions — Offload small, latency-sensitive tasks or implement protocol handlers using embedded memory and dedicated arithmetic chains.

Unique Advantages

• Balanced Logic and Memory — A combination of 1,728 logic elements and 12,288 RAM bits provides the flexibility to implement control logic alongside modest embedded memory needs without external RAM.
• High I/O Count in Compact Package — 147 user I/Os in a 208-pin surface-mount package supports dense interfacing while keeping board footprint compact.
• Field Reconfigurable — Supports in-circuit reconfiguration and JTAG boundary-scan for on-board updates and factory test access, simplifying development and maintenance.
• Family-Level Routing and Arithmetic Support — FastTrack interconnect plus dedicated carry and cascade chains accelerate arithmetic and high-fan-in logic implementations through tool-driven optimizations.
• Commercial-Grade, RoHS Compliant — Designed for commercial temperature ranges and compliant with RoHS requirements to meet common procurement and environmental constraints.

Why Choose EPF10K30AQC208-1?

The EPF10K30AQC208-1 delivers a practical balance of logic, embedded memory and I/O in a 208-pin surface-mount package suited to commercial embedded designs. Its FLEX-10KA family features—such as embedded array blocks, FastTrack interconnect and JTAG reconfigurability—help engineers consolidate functions on a programmable device and iterate designs quickly.

This device is well suited for designers who need moderate logic density with on-chip RAM and a high I/O count for interfacing, prototyping, or performing glue-logic and protocol tasks while maintaining commercial-grade operating specifications and RoHS compliance.

Request a quote or submit a purchase inquiry to obtain pricing and availability for EPF10K30AQC208-1. Provide your part number and required quantity to start the procurement process.