EPF10K30AQC208-2N

The EPF10K30AQC208-2N is a FLEX-10KA field programmable gate array packaged in a 208-BFQFP surface-mount device. Part of the FLEX 10K family, this device combines a logic array and embedded array resources to implement general-purpose logic alongside specialized megafunctions and on-chip memory.

Designed for commercial embedded and system-level applications, the device targets designs that require medium-density programmable logic, embedded memory, and flexible I/O in a compact 208-pin package.

Key Features

• Logic Capacity — 1,728 logic elements organized into 216 LABs, enabling medium-density logic integration for control, glue-logic, and custom processing functions.
• Embedded Memory — 12,288 total RAM bits available for implementing FIFOs, small buffers, or on-chip state storage.
• I/O Density — 147 user I/O pins to support multiple peripheral interfaces and board-level signal routing.
• Gate Equivalent — Approximately 69,000 gates (typical/maximum system gates as indicated by family data) for mixed logic and memory implementations.
• Supply and Power — Operates from a 3.0 V to 3.6 V supply range, matching 3.3 V system rails common in embedded designs.
• Package & Mounting — 208-BFQFP (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for PCB assembly.
• Operating Conditions — Commercial-grade operating temperature range of 0 °C to 70 °C.
• In-system Configuration & Test — Family-level support for in-circuit reconfigurability (ICR) via external configuration devices or JTAG, plus IEEE 1149.1 boundary-scan test support.
• Standards & Compliance — RoHS compliant, aligned with modern environmental requirements.
• Family Capabilities — As a FLEX 10KA device, the family includes embedded array blocks for megafunctions, multi-volt I/O support, low-power standby behavior, and clock distribution features described in the FLEX 10K family documentation.

Typical Applications

• Embedded Control — Implement control logic, state machines, and peripheral glue in industrial and commercial embedded systems requiring medium-density programmable logic.
• Interface Bridging — Use the available I/O and on-chip logic to bridge between digital buses, translate protocols, or implement custom interface logic.
• Prototyping & Development — Medium-density designs and SOPC-style integration make this device suitable for hardware prototyping and proof-of-concept systems that combine logic and embedded memory.
• Custom Peripherals — Implement bespoke peripherals, small accelerators, or timing-critical control blocks using dedicated carry and cascade chains present in the FLEX 10K family.

Unique Advantages

• Balanced Logic and Memory: Combines 1,728 logic elements with 12,288 bits of embedded RAM, enabling mixed logic-plus-buffer designs without external memory for many use cases.
• Compact, PCB-friendly Package: 208-BFQFP surface-mount package provides high pin count in a 28×28 form factor suitable for space-constrained boards.
• Flexible Configuration and Test: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support simplify development, programming, and board-level testing.
• Design Ecosystem Support: The FLEX 10K family is supported by established Altera development systems and design tools, enabling automated place-and-route and megafunction integration.
• Commercial Temperature and Supply Compatibility: 3.0–3.6 V operating range and 0 °C to 70 °C rating match common commercial 3.3 V system environments.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose EPF10K30AQC208-2N?

The EPF10K30AQC208-2N positions itself as a practical choice for medium-density programmable logic needs where a blend of logic elements, embedded RAM, and flexible I/O is required in a compact package. Its inclusion in the FLEX 10K family brings family-level capabilities—such as embedded array blocks, in-system configuration, and proven design tool support—into designs that benefit from on-chip megafunctions and predictable routing.

This device is well suited to companies and engineers developing commercial embedded systems, interface logic, and prototypes that require reliable functionality, board-level testability, and integration with existing 3.3 V designs. The combination of on-chip memory, substantial I/O count, and surface-mount 208-BFQFP packaging delivers a balanced platform for reducing external components and accelerating time-to-market.

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