EPF10K30AQC208-3N

IC FPGA 147 I/O 208QFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP

Quantity 173 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates69000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K30AQC208-3N – FLEX-10KA Field Programmable Gate Array, 208-BFQFP

The EPF10K30AQC208-3N is a FLEX-10KA family field programmable gate array (FPGA) from Intel (Altera) in a 208-BFQFP surface-mount package. It provides a mid-density programmable logic fabric combining logic array blocks and embedded memory for implementing custom digital functions and system-level megafunctions.

With 1,728 logic elements across 216 logic array blocks, approximately 12,288 bits of embedded RAM, and 147 user I/O pins, this commercial-grade device targets embedded and interface-centric designs that require on-chip memory, flexible I/O, and in-circuit reconfigurability within a 3.0 V to 3.6 V supply and 0 °C to 70 °C operating range.

Key Features

  • Core logic density — 1,728 logic elements implemented across 216 logic array blocks, representing a device with approximately 69,000 gates for mid-density programmable logic.
  • Embedded memory — Total RAM bits: 12,288, enabling on-chip buffering, small tables, and megafunction implementation without external memory.
  • I/O capacity and flexibility — 147 user I/O pins provide ample connectivity for multi-interface designs; family features include programmable output slew-rate control, individual tri-state control, and open-drain options for flexible signaling.
  • Configuration and test — Supports in-circuit reconfigurability via external configuration device or JTAG port; built-in JTAG boundary-scan test (BST) circuitry is available without consuming user logic (family-level feature).
  • Power and supply — Operates from a 3.0 V to 3.6 V supply, allowing integration into 3.3 V system environments.
  • Package and mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) surface-mount package for compact PCB integration.
  • Commercial grade and environmental compliance — Commercial temperature range of 0 °C to 70 °C and RoHS compliant.
  • Family-level system features — FLEX 10K family supports System-on-a-Programmable-Chip (SOPC) integration, dedicated carry and cascade chains, low-skew clock distribution, and software design support from Altera development systems (family-level features).

Typical Applications

  • Embedded control and logic — Implement custom control logic, state machines, and glue logic where on-chip RAM and moderate logic density reduce external components.
  • Interface bridging — Use the 147 I/O pins to consolidate multiple interfaces or translate between subsystems in communication or instrumentation equipment.
  • On-board buffering and small memory functions — Leverage the 12,288 bits of embedded RAM for FIFO buffers, lookup tables, and temporary data storage without adding external memory.
  • Prototyping and evaluation — Suitable for validating mid-density FPGA designs and developing megafunctions within the FLEX 10K family ecosystem.

Unique Advantages

  • Balanced mid-range capacity: 1,728 logic elements and ~69,000 gates deliver the right balance of density for many embedded and interface designs without the overhead of higher-density devices.
  • On-chip memory for megafunctions: 12,288 bits of embedded RAM support implementing memory-intensive functions and reduce external BOM complexity.
  • High connectorization potential: 147 user I/O pins enable multi-signal designs and reduce the need for external interface ICs.
  • Compact surface-mount package: 208-BFQFP (28×28 PQFP footprint) provides a compact solution for board-space constrained layouts while remaining surface-mount compatible.
  • Design and test support: Family-level JTAG boundary-scan and Altera development system support aid in configuration, verification, and automated place-and-route flows.
  • RoHS compliant, commercial temperature: Meets environmental compliance requirements for commercial applications operating between 0 °C and 70 °C.

Why Choose EPF10K30AQC208-3N?

The EPF10K30AQC208-3N positions itself as a practical choice for developers who need a mid-density FPGA with integrated RAM and substantial I/O count in a compact surface-mount package. Its combination of 1,728 logic elements, 12,288 bits of embedded memory, and 147 I/O pins supports a wide range of embedded functions—reducing external components and simplifying board design.

This device is suited for commercial designs that benefit from on-chip memory, flexible I/O options, and family-level features such as in-circuit reconfigurability and JTAG boundary-scan. Supported by the FLEX 10K family design resources, it offers a viable, verifiable path for mid-range programmable logic implementations.

Request a quote or submit an inquiry to get pricing and availability for EPF10K30AQC208-3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up