EPF10K30AQC208-3N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 147 12288 1728 208-BFQFP |
|---|---|
| Quantity | 173 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 69000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K30AQC208-3N – FLEX-10KA Field Programmable Gate Array, 208-BFQFP
The EPF10K30AQC208-3N is a FLEX-10KA family field programmable gate array (FPGA) from Intel (Altera) in a 208-BFQFP surface-mount package. It provides a mid-density programmable logic fabric combining logic array blocks and embedded memory for implementing custom digital functions and system-level megafunctions.
With 1,728 logic elements across 216 logic array blocks, approximately 12,288 bits of embedded RAM, and 147 user I/O pins, this commercial-grade device targets embedded and interface-centric designs that require on-chip memory, flexible I/O, and in-circuit reconfigurability within a 3.0 V to 3.6 V supply and 0 °C to 70 °C operating range.
Key Features
- Core logic density — 1,728 logic elements implemented across 216 logic array blocks, representing a device with approximately 69,000 gates for mid-density programmable logic.
- Embedded memory — Total RAM bits: 12,288, enabling on-chip buffering, small tables, and megafunction implementation without external memory.
- I/O capacity and flexibility — 147 user I/O pins provide ample connectivity for multi-interface designs; family features include programmable output slew-rate control, individual tri-state control, and open-drain options for flexible signaling.
- Configuration and test — Supports in-circuit reconfigurability via external configuration device or JTAG port; built-in JTAG boundary-scan test (BST) circuitry is available without consuming user logic (family-level feature).
- Power and supply — Operates from a 3.0 V to 3.6 V supply, allowing integration into 3.3 V system environments.
- Package and mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) surface-mount package for compact PCB integration.
- Commercial grade and environmental compliance — Commercial temperature range of 0 °C to 70 °C and RoHS compliant.
- Family-level system features — FLEX 10K family supports System-on-a-Programmable-Chip (SOPC) integration, dedicated carry and cascade chains, low-skew clock distribution, and software design support from Altera development systems (family-level features).
Typical Applications
- Embedded control and logic — Implement custom control logic, state machines, and glue logic where on-chip RAM and moderate logic density reduce external components.
- Interface bridging — Use the 147 I/O pins to consolidate multiple interfaces or translate between subsystems in communication or instrumentation equipment.
- On-board buffering and small memory functions — Leverage the 12,288 bits of embedded RAM for FIFO buffers, lookup tables, and temporary data storage without adding external memory.
- Prototyping and evaluation — Suitable for validating mid-density FPGA designs and developing megafunctions within the FLEX 10K family ecosystem.
Unique Advantages
- Balanced mid-range capacity: 1,728 logic elements and ~69,000 gates deliver the right balance of density for many embedded and interface designs without the overhead of higher-density devices.
- On-chip memory for megafunctions: 12,288 bits of embedded RAM support implementing memory-intensive functions and reduce external BOM complexity.
- High connectorization potential: 147 user I/O pins enable multi-signal designs and reduce the need for external interface ICs.
- Compact surface-mount package: 208-BFQFP (28×28 PQFP footprint) provides a compact solution for board-space constrained layouts while remaining surface-mount compatible.
- Design and test support: Family-level JTAG boundary-scan and Altera development system support aid in configuration, verification, and automated place-and-route flows.
- RoHS compliant, commercial temperature: Meets environmental compliance requirements for commercial applications operating between 0 °C and 70 °C.
Why Choose EPF10K30AQC208-3N?
The EPF10K30AQC208-3N positions itself as a practical choice for developers who need a mid-density FPGA with integrated RAM and substantial I/O count in a compact surface-mount package. Its combination of 1,728 logic elements, 12,288 bits of embedded memory, and 147 I/O pins supports a wide range of embedded functions—reducing external components and simplifying board design.
This device is suited for commercial designs that benefit from on-chip memory, flexible I/O options, and family-level features such as in-circuit reconfigurability and JTAG boundary-scan. Supported by the FLEX 10K family design resources, it offers a viable, verifiable path for mid-range programmable logic implementations.
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