EPF10K30AQC240-2

The EPF10K30AQC240-2 is a FLEX 10KA family field-programmable logic device from Intel intended for commercial embedded applications. As a member of the FLEX 10K embedded programmable logic family, it supports System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient memory and specialized logic functions.

With 1,728 logic elements, 12,288 bits of embedded RAM, and 189 user I/O pins in a 240-pin BFQFP package, this device targets compact designs that require flexible on-chip logic, on-chip memory, and extensive peripheral connectivity while operating from a 3.0 V to 3.6 V supply.

Key Features

• Core Logic — 1,728 logic elements and 216 LABs provide the programmable logic fabric for implementing custom logic and control functions.
• Embedded Memory — 12,288 total RAM bits of on-chip embedded memory for fast, local storage and application-specific megafunctions.
• I/O and Peripheral Support — 189 user I/O pins with per-pin programmability and flexible interfacing for connecting to external peripherals and buses.
• System-Level Features — Series-level capabilities include in-circuit reconfigurability options and IEEE 1149.1 JTAG boundary-scan for device programming and test.
• Clock and Arithmetic Support — Device family implements dedicated carry and cascade chains and low-skew clock distribution trees for arithmetic functions and synchronous designs.
• Power and Temperature — Operates from 3.0 V to 3.6 V with an operating temperature range of 0 °C to 70 °C, suited for commercial-grade systems.
• Package & Mounting — 240-BFQFP (supplier package 240-PQFP, 32×32) in a surface-mount form factor for board-level assembly and compact layouts.
• Compliance — RoHS compliant, meeting lead-free and hazardous substance requirements for modern assemblies.

Typical Applications

• Embedded control and logic acceleration — Implement application-specific control logic, protocol handling, and glue logic with on-chip RAM and programmable fabric.
• Memory and megafunction implementation — Use the device’s embedded RAM and logic array to implement efficient memory blocks and specialized logic functions within a single chip.
• Peripheral interfacing and connectivity — High I/O count supports dense peripheral connections, bus interfacing, and front-end logic for commercial systems.
• Prototyping and system integration — In-circuit reconfigurability and JTAG support simplify device programming and iterative design validation for commercial product development.

Unique Advantages

• Balanced logic and memory — 1,728 logic elements paired with 12,288 bits of embedded RAM lets you colocate logic and data storage for lower-latency designs.
• High peripheral density — 189 user I/Os enable broad external connectivity without additional interface ICs, reducing board-level complexity.
• Commercial operating range — 3.0 V to 3.6 V supply and 0 °C to 70 °C operating temperature align this device to mainstream commercial embedded products.
• Compact surface-mount package — 240-pin BFQFP package supports compact PCB layouts while preserving accessibility to signals and power pins.
• Design and test friendliness — Built-in JTAG boundary-scan and support for in-circuit reconfiguration streamline programming, manufacturing test, and design iteration.
• RoHS compliant — Meets environmental requirements for contemporary assembly processes.

Why Choose EPF10K30AQC240-2?

The EPF10K30AQC240-2 combines a mid-range logic element count with on-chip RAM and a high I/O count in a compact, commercial-grade BFQFP package. It is well suited for engineers building commercial embedded systems that need integrated memory, configurable logic, and flexible peripheral connectivity while operating from a 3.0 V–3.6 V supply.

As part of the FLEX 10KA family from Intel, this device offers a blend of programmable logic resources and system-level features—such as JTAG and in-circuit reconfiguration—that help accelerate development and simplify board-level design choices for production deployments.

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